5SGXMA7K1F40C1WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 569 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K1F40C1WN – Stratix® V GX FPGA (696 I/Os, 1517‑BBGA)

The 5SGXMA7K1F40C1WN is a Stratix® V GX field‑programmable gate array (FPGA) IC offering very large logic capacity and a high I/O count in a 1517‑ball FCBGA package. With 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, this commercial‑grade device is suited for designs that require substantial on‑chip logic, memory, and dense I/O integration.

Designed for surface‑mount applications, the device operates over a commercial temperature range (0 °C to 85 °C) and supports a nominal core supply window between 870 mV and 930 mV, providing predictable electrical operating conditions for complex digital systems.

Key Features

  • High Logic Capacity — 622,000 logic elements to implement large-scale digital designs, custom accelerators, or complex state machines.
  • Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for buffering, packet queues, and large shared memory structures without external DRAM.
  • Extensive I/O — 696 user I/Os enabling dense interfacing to high‑pin‑count boards, mezzanines, or multi‑lane peripherals.
  • Package & Mounting — 1517‑BBGA (FCBGA) surface‑mount package; supplier package listed as 1517‑FBGA (40×40) for compact, high‑pin‑count PCB designs.
  • Power Supply Range — Core supply specified from 870 mV to 930 mV to support regulated core voltage domains and power planning.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • RoHS Compliant — Conforms to RoHS directives for lead‑free assembly and environmental requirements.

Typical Applications

  • High‑density digital processing — Implement complex logic, datapaths, and custom compute functions using the device’s large logic and memory resources.
  • Network and telecom infrastructure — Use the high I/O count and on‑chip RAM for packet processing, buffering, and protocol handling in communication equipment.
  • Prototyping and system integration — Integrate large IP blocks and system functions on a single FPGA for rapid validation and proof‑of‑concept platforms.
  • Custom accelerator boards — Deploy the device where dense logic and local memory improve throughput for application‑specific acceleration tasks.

Unique Advantages

  • Substantial on‑chip resources: 622,000 logic elements and ~51.2 Mbits of RAM reduce dependence on external components and simplify board routing.
  • High I/O density: 696 I/Os support complex, multi‑lane interfaces and rich peripheral connectivity without multi‑chip solutions.
  • Compact, manufacturable package: 1517‑BBGA FCBGA (1517‑FBGA 40×40) enables high pin density in a PCB‑friendly form factor for surface‑mount assembly.
  • Predictable electrical envelope: Defined core supply range (870 mV–930 mV) supports consistent power budgeting and regulator selection.
  • Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products.

Why Choose 5SGXMA7K1F40C1WN?

The 5SGXMA7K1F40C1WN positions itself as a high‑capacity FPGA option for engineers who need abundant logic, embedded memory, and large I/O capability in a single device. Its combination of 622,000 logic elements, approximately 51.2 Mbits of RAM, and 696 I/Os makes it a practical choice for complex digital systems, network equipment, and custom accelerator designs where integration and density matter.

Backed by Stratix V GX family documentation and designed for surface‑mount assembly in a 1517‑ball FCBGA package, this device is intended for commercial applications that require robust on‑chip resources and clear electrical operating parameters for power and thermal planning.

Request a quote or submit an inquiry to check pricing, availability, and lead times for the 5SGXMA7K1F40C1WN. Provide your quantity and timeline to receive a prompt response for procurement and design planning.

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