5SGXMA7H2F35C3WN

The 5SGXMA7H2F35C3WN is a Stratix® V GX field programmable gate array (FPGA) in a 1152-ball BGA package designed for commercial applications. It provides a large logic fabric and embedded memory capacity paired with a high I/O count to support complex digital designs and dense I/O requirements.

With a specified core supply range and commercial temperature grading, this device is intended for integration into systems where a high number of logic elements, substantial on-chip RAM, and extensive I/O connectivity are required.

Key Features

• Core Logic  Approximately 622,000 logic elements for implementing large-scale custom logic and complex finite-state machines.
• Embedded Memory  Approximately 51 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Capacity  552 user I/Os to accommodate high-pin-count interfaces and multiple parallel or serial connections.
• Package & Mounting  1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount assembly suitable for space-efficient board designs.
• Power  Core voltage supply range specified from 820 mV to 880 mV to match targeted system power rails.
• Temperature & Grade  Commercial grade with operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded RAM to implement complex datapaths, custom accelerators, and protocol engines.
• High-pin-count interface aggregation  Leverage 552 I/Os to consolidate multiple peripheral interfaces or parallel buses in a single device.
• System integration  Combine logic, memory, and I/O in the compact 1152-BBGA package to reduce board-level component count and simplify system architecture.

Unique Advantages

• High logic density: The device’s ~622,000 logic elements enable integration of large or multiple subsystems into a single FPGA, reducing external components.
• Substantial on-chip memory: Approximately 51 Mbits of embedded RAM provide local storage for buffering, tables, and state, reducing reliance on external memory.
• Extensive I/O support: 552 I/Os allow flexible connectivity to sensors, peripherals, or parallel interfaces without external multiplexing.
• Compact BGA packaging: The 1152-ball FCBGA (35×35) package offers high pin density in a surface-mount form factor suitable for compact PCBs.
• Commercial temperature grading: Rated for 0 °C to 85 °C operation to match standard commercial electronics environments.
• RoHS compliant: Meets environmental compliance requirements for many commercial product lines.

Why Choose 5SGXMA7H2F35C3WN?

This Stratix V GX device is positioned for designs that require a high logic element count, significant on-chip RAM, and broad I/O capability in a compact BGA package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of commercial electronic systems where integration density and I/O capacity are primary design drivers.

Choose the 5SGXMA7H2F35C3WN when you need a dense, RoHS-compliant FPGA platform that consolidates logic, memory, and I/O to simplify board design, support complex custom logic, and scale with system requirements.

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