5SGXMA7K3F35I3G

The 5SGXMA7K3F35I3G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA FCBGA package. It delivers a high-density, industrial-grade programmable logic platform with 622,000 logic elements and approximately 51.2 Mbits of embedded memory, suited for designs that require substantial on-chip resources and flexible I/O.

Packaged for surface-mount assembly, this device provides 432 user I/O pins, a core voltage supply range of 820 mV to 880 mV, and an operating temperature range of –40 °C to 100 °C. It is RoHS compliant.

Key Features

• Core Logic  622,000 logic elements for high-density programmable logic and complex digital implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage.
• I/O Capacity  432 user I/O pins to accommodate multi-channel interfaces and high pin-count system designs.
• Package & Mounting  1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35) designed for surface-mount assembly in compact, high-density boards.
• Power Requirements  Core supply voltage between 820 mV and 880 mV for compatibility with regulated FPGA core rails.
• Temperature & Grade  Industrial temperature grade with an operating range of –40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Use the large logic element count to implement complex state machines, custom datapaths, and algorithm acceleration.
• Memory-intensive designs  Leverage approximately 51.2 Mbits of embedded RAM for packet buffering, frame storage, and high-throughput data pipelines.
• Multi-interface I/O platforms  432 I/O pins enable integration of numerous external peripherals, multiple parallel interfaces, or wide data buses.
• Industrial-grade embedded systems  The –40 °C to 100 °C operating range and industrial grade make this device suitable for industrial control and instrumentation where extended temperature tolerance is required.

Unique Advantages

• High logic capacity: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external memory and improves data throughput and latency.
• Generous I/O count: 432 user I/Os support dense connectivity and simplify routing for multi-channel and parallel interfaces.
• Industrial temperature rating: Rated for –40 °C to 100 °C operation, supporting reliable operation in temperature-challenging environments.
• Compact FCBGA package: 1152-ball FCBGA (35×35) balances high pin count with a compact footprint for space-constrained system boards.
• Regulated core voltage support: Defined core supply range (820 mV–880 mV) aligns with precise power delivery schemes used in modern FPGA systems.

Why Choose 5SGXMA7K3F35I3G?

The 5SGXMA7K3F35I3G positions itself as a high-density, industrial-grade Stratix V GX FPGA option for designs that demand significant programmable logic, on-chip memory, and extensive I/O. Its combination of 622,000 logic elements and approximately 51.2 Mbits of embedded RAM enables integration of complex algorithms and large data buffers on a single device.

With a robust operating temperature range and a compact 1152-BBGA FCBGA package, this device is suitable for engineers designing space-constrained, high-performance embedded systems requiring reliable operation across industrial temperature ranges.

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