5SGXMA7K3F35I3N

The 5SGXMA7K3F35I3N is a high-capacity Stratix V GX field programmable gate array offered in an industrial temperature grade and a 1152‑FBGA (35×35) package. It delivers a large logic fabric with substantial embedded memory and extensive I/O to support complex, high-density digital designs.

With approximately 622,000 logic elements, roughly 51.2 Mbits of embedded memory and 432 I/O pins, this device is well suited for designs that require significant on-chip resources and robust thermal and voltage operating ranges.

Key Features

• Logic Capacity — Approximately 622,000 logic elements to implement large, complex FPGA designs and custom logic functions.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and large state machines without external memory.
• I/O Resources — 432 user I/O pins for dense interfacing to peripherals, transceivers, and board-level connectivity.
• Package & Mounting — 1152‑BBGA (FCBGA) supplier device package in a 35×35 format, optimized for surface-mount assembly.
• Power Supply Range — Core voltage supply between 820 mV and 880 mV to meet the device’s specified operating window.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards Compliance — RoHS compliant to meet environmental and regulatory requirements.
• Series Characteristics — As a Stratix V GX device, the series is documented with multiple transceiver and core speed grades (series-level information available in the Stratix V device datasheet).

Typical Applications

• Industrial Control and Automation — High logic density and industrial temperature rating make the device suitable for complex control algorithms, motor drives, and factory automation systems.
• Communications and Networking — Large embedded memory and abundant I/O support packet buffering, protocol processing, and multi‑lane interface implementations.
• Data Processing and Acceleration — Substantial logic and memory resources enable implementation of custom data-paths, parallel processing engines, and hardware accelerators.
• Test & Measurement — The combination of high I/O count and on-chip resources supports custom instrumentation, signal processing, and data capture systems.

Unique Advantages

• High on‑chip integration: Large logic element count and approximately 51.2 Mbits of embedded RAM reduce dependence on external components and simplify PCB design.
• Robust I/O capacity: 432 I/O pins provide flexibility for dense board-level interconnect and multi-protocol interfacing.
• Industrial-grade operation: Specified for −40 °C to 100 °C operation, enabling deployment in demanding thermal environments.
• Compact, serviceable package: 1152‑FBGA (35×35) package supports surface-mount assembly while delivering high pin-count connectivity.
• Controlled core voltage range: Defined supply window (820 mV–880 mV) assists in predictable power provisioning and system-level power planning.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMA7K3F35I3N?

The 5SGXMA7K3F35I3N combines high logic density, significant on‑chip memory and a large I/O complement in a surface-mount 1152‑FBGA package, making it a fit for industrial and high-performance digital designs that need integrated resources and robust operating margins. Its specified core voltage range and industrial temperature rating provide predictability for thermal and power-constrained systems.

This device is appropriate for design teams implementing large-scale FPGA designs that require scalability of logic and memory resources, along with the ability to interface to many external signals while maintaining RoHS compliance.

Request a quote or submit a purchasing inquiry to begin evaluating the 5SGXMA7K3F35I3N for your next design project.