5SGXMA7K3F35I3WN

The 5SGXMA7K3F35I3WN is an Intel Stratix® V GX field-programmable gate array (FPGA) delivered in a 1152-ball FCBGA package. It combines high logic density, substantial on-chip memory capacity, and a large I/O count in an industrial-grade device.

This device is suitable for designs that require extensive programmable logic resources, abundant embedded memory, and a high number of I/Os while operating across an industrial temperature range and low core supply voltage.

Key Features

• Logic Capacity — 622,000 logic elements providing large programmable logic resources for high-density designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive logic functions.
• I/O Resources — 432 I/Os to support wide parallel interfaces, multiple peripherals, and complex board-level connectivity.
• Package — 1152-BBGA, FCBGA (supplier device package: 1152-FBGA (35x35)), offering a high-pin-count surface-mount solution.
• Power — Core voltage supply range of 820 mV to 880 mV for the FPGA core.
• Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Mounting — Surface mount device suitable for standard PCB assembly processes.
• Environmental Compliance — RoHS compliant.
• Family and Documentation — Part of the Stratix V GX family; consult the Stratix V device datasheet for electrical and switching characteristics and supported transceiver speed grades.

Typical Applications

• Industrial Embedded Systems — Use the device where industrial temperature operation and high logic density are required for control, signal processing, or protocol handling.
• High‑I/O Data Aggregation — Leverage 432 I/Os for designs that require broad parallel connectivity or multiple interface endpoints.
• Memory-Intensive Logic — Use the approximately 51.2 Mbits of embedded RAM for buffering, packet storage, or large state machines.
• High-Density FPGA Integration — Integrate substantial programmable logic in systems that need to consolidate functions onto a single programmable device.

Unique Advantages

• High Logic Density: 622,000 logic elements enable consolidation of complex functions and large designs into a single FPGA device, reducing multi-chip BOM.
• Significant On-Chip Memory: Approximately 51.2 Mbits of embedded RAM supports data-intensive algorithms and reduces dependence on external memory.
• Generous I/O Count: 432 I/Os allow flexible board-level interfacing and support for multiple high-pin-count peripherals and buses.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact High-Pin-Count Package: 1152-ball FCBGA package provides high connectivity while maintaining a compact PCB footprint for dense system designs.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose 5SGXMA7K3F35I3WN?

The 5SGXMA7K3F35I3WN positions itself as a high-density, industrial-grade Stratix V GX FPGA that balances large programmable logic capacity, substantial embedded memory, and extensive I/O in a single 1152-ball FCBGA package. Its low core supply range and industrial temperature rating make it appropriate for designers targeting robust, space-efficient FPGA solutions.

Engineers and procurement teams seeking to consolidate complex logic, support memory-heavy workloads, and maximize board-level connectivity will find this device suitable for demanding embedded and industrial applications. Technical reference and electrical characteristics are provided in the Stratix V device datasheet for detailed integration and system-level planning.

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