5SGXMA7K3F35I4WN

The 5SGXMA7K3F35I4WN is a Stratix® V GX FPGA from Intel, designed for high-density programmable logic deployments. It combines a large logic capacity with substantial on-chip memory and a high I/O count to address complex, board-level digital designs.

Targeted at applications that require extensive logic resources, embedded memory, and robust I/O in an industrial-temperature FPGA, this device delivers integrated capabilities in a 1152-pin FCBGA package with surface-mount mounting.

Key Features

• Logic Capacity  Provides 622,000 logic elements for implementing complex digital functions and compute pipelines.
• Embedded Memory  Includes approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms.
• I/O Resources  Offers 432 general-purpose I/Os to support wide parallel interfaces and high-pin-count system integration.
• Power Supply Range  Core voltage supply range of 820 mV to 880 mV to match platform power designs and core voltage rails.
• Package & Mounting  Supplied in a 1152-BBGA (1152‑FBGA, 35×35) FCBGA package for board-level deployment; surface-mount mounting type.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to support industrial and harsh-environment applications.
• Manufacturer & Documentation  Intel Stratix V family device with available device datasheet and technical documentation.
• RoHS Compliant  Device is RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control & Automation  Industrial-temperature rating and large logic/memory make this FPGA suitable for control systems and machine automation requiring reliable operation across wide temperatures.
• High-Density Digital Processing  Large logic element count and substantial on-chip RAM enable implementation of complex DSP, packet processing, and custom compute pipelines.
• Board-Level High-Pin-Count I/O  With 432 I/Os, the device supports wide parallel interfaces, multi-lane buses, and dense peripheral connectivity on single boards.
• System Prototyping & Integration  High logic and memory resources in a single FCBGA package facilitate prototype systems and integration where board space and consolidation matter.

Unique Advantages

• High Logic Density: 622,000 logic elements give designers the headroom to implement large-scale digital functions without splitting designs across multiple devices.
• Substantial Embedded Memory: Approximately 51.2 Mbits of on-chip RAM reduce dependency on external memory for buffering and accelerate on-chip data paths.
• Extensive I/O: 432 I/Os simplify board-level routing for multi-channel interfaces and dense peripheral connections.
• Industrial Temperature Support: Rated from –40 °C to 100 °C for deployments that require extended temperature operation.
• Compact FCBGA Packaging: 1152-BBGA (35×35) package balances high integration with PCB footprint efficiency for system-level designs.
• Controlled Core Voltage Range: 0.82–0.88 V core supply window supports integration into controlled power architectures.

Why Choose 5SGXMA7K3F35I4WN?

This Stratix® V GX FPGA delivers a balanced combination of high logic capacity, ample embedded memory, and extensive I/O in an industrial-grade, surface-mount FCBGA package. It is well suited to engineers building complex digital systems that require consolidation of functions, reliable operation across wide temperatures, and strong on-chip resources.

As an Intel Stratix V family device, it is supported by device documentation and datasheet material to aid in design, validation, and system integration, offering a scalable option for demanding board-level FPGA implementations.

Request a quote or submit an inquiry to begin evaluation and procurement of 5SGXMA7K3F35I4WN for your next high-density FPGA design.