5SGXMA7K3F40C2LN

The 5SGXMA7K3F40C2LN is a Stratix® V GX family FPGA from Intel (Altera) delivered in a 1517-BBGA FCBGA package. It provides a high logic capacity device architecture with extensive embedded memory and a large I/O count for demanding system-level designs.

With 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM, this commercial-grade device targets applications that require dense logic integration, substantial embedded memory, and broad interface connectivity while operating within a commercial temperature range.

Key Features

• Core Logic  622,000 logic elements (cells) to implement complex digital designs and large-scale logic functions.
• Embedded Memory  Approximately 51.2 Mbits of total on-chip RAM for buffering, LUT-based storage, and algorithm state storage.
• I/O Density  696 user I/O pins to support high-connectivity systems and multi-channel interfaces.
• Transceiver Family (Series-Level)  Stratix V GX devices are documented in the series datasheet with GX transceiver speed-grade options (series-level information provided in the datasheet).
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV to match system power-rail design requirements.
• Package & Mounting  1517-BBGA FCBGA (supplier package listed as 1517-FBGA, 40×40) in a surface-mount form factor for board-level integration.
• Temperature & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic capacity and embedded memory for complex signal processing, algorithm acceleration, and custom compute tasks.
• Protocol aggregation and bridging  Leverage the high I/O count to consolidate multiple interfaces and implement glue logic or protocol translation in system designs.
• Prototyping and system integration  Deploy the device for board-level prototypes that require substantial on-chip resources and real-world I/O connectivity.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive I/O capacity: 696 I/O pins provide flexibility for multi-channel designs and parallel interfacing without external multiplexing.
• Compact, manufacturable package: 1517-BBGA FCBGA surface-mount package supports high-density PCB layouts and standard assembly processes.
• Controlled core voltage: Defined supply range (820 mV–880 mV) enables precise power delivery planning and thermal/power budgeting.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet typical commercial electronics deployment requirements.
• Regulatory compliance: RoHS-compliant construction supports environmental and manufacturing requirements.

Why Choose 5SGXMA7K3F40C2LN?

The 5SGXMA7K3F40C2LN combines high logic capacity, substantial embedded memory, and a large I/O complement in a production-ready surface-mount BBGA package. Its specification set addresses designs requiring dense on-chip resources and broad interface connectivity while operating within a commercial temperature range and standardized power envelope.

This device is suited for engineering teams implementing complex digital systems, large custom accelerators, or multi-interface boards that benefit from consolidating logic and memory on a single FPGA platform backed by Intel (Altera) Stratix V series documentation.

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