5SGXMA7K3F40C2N

The 5SGXMA7K3F40C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) offered by Intel. This commercial-grade, surface-mount FPGA provides very high logic density and substantial on-chip memory for complex, programmable digital designs.

With a large I/O count and a low-voltage core supply window, the device is suited to designs requiring significant embedded logic capacity, on-chip memory, and dense external connectivity while remaining within commercial temperature limits.

Key Features

• Core Logic — Approximately 622,000 logic elements, enabling large-scale programmable logic implementations and complex custom datapaths.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM, supporting memory-heavy functions such as buffering, packet queues, or large LUT-based designs.
• I/O Density — 696 available I/O pins, providing extensive connectivity options for high-pin-count interfaces and multi-channel systems.
• Packaging — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40 × 40), delivered in a surface-mount form factor for PCB assembly.
• Power — Core supply specified from 870 mV to 930 mV, allowing designers to plan power delivery and decoupling consistent with the device’s requirements.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
• Standards Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic systems — Use the large logic element count for complex state machines, protocol processors, and custom compute blocks.
• Memory-intensive designs — Leverage approximately 51.2 Mbits of embedded RAM for buffering, packet handling, and data staging without external memory for some functions.
• I/O-rich platforms — Deploy in systems that require many parallel interfaces or multi-channel front-ends thanks to 696 I/O pins.

Unique Advantages

• High integration density: The combination of ~622k logic elements and ~51.2 Mbits of on-chip RAM reduces reliance on external logic and memory components.
• Extensive I/O capability: 696 I/Os enable complex interconnects and multiple peripheral interfaces on a single device footprint.
• Surface-mount FCBGA package: The 1517-BBGA package supports compact board layouts and high pin-count routing while matching standard SMT assembly processes.
• Commercial-grade thermal range: Rated 0 °C to 85 °C for designs targeting commercial environments and consumer or enterprise equipment.
• Regulatory readiness: RoHS compliance simplifies environmental qualification and supply-chain acceptance.

Why Choose 5SGXMA7K3F40C2N?

The 5SGXMA7K3F40C2N combines high logic density, substantial embedded memory, and a very large I/O complement in a surface-mount FCBGA package, making it well suited for complex, connectivity-heavy programmable designs in commercial environments. Its defined core supply window and commercial temperature rating simplify integration into systems where power budgeting and thermal planning are key considerations.

For engineering teams requiring a high-capacity Stratix V GX FPGA from Intel, this device offers a clear balance of logic resources, on-chip memory, and I/O scalability while conforming to RoHS environmental requirements.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXMA7K3F40C2N. Our team can provide lead-time information and support for BOM planning and integration.