5SGXMA7K3F40C3G

The 5SGXMA7K3F40C3G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA package. This device provides substantial programmable logic and embedded memory to support complex, high-density digital designs.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory and 696 I/O pins, the device targets applications that require large logic capacity, extensive I/O, and on-chip buffering. It is supplied as a commercial-grade part with a specified operating range and low-voltage core supply.

Key Features

• Logic Capacity  622,000 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for data buffering, FIFOs and local storage.
• I/O Density  696 user I/O pins for broad external interface support and high pin-count routing.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting type.
• Core Voltage  Core supply range 0.820 V to 0.880 V (820 mV to 880 mV) for the device core power domain.
• Operating Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑capacity FPGA designs  Large programmable logic implementations that require hundreds of thousands of logic elements and sizable embedded memory.
• High‑I/O systems  Board-level designs needing extensive external connectivity supported by 696 I/O pins.
• On‑chip buffering and data paths  Applications that leverage approximately 51.2 Mbits of embedded RAM for local data storage and low-latency buffering.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of complex functions into a single device, reducing system-level component count.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM supports larger data structures and reduces dependence on external memory.
• Extensive I/O: 696 I/Os provide flexibility for parallel interfaces, signal routing and multi‑lane connectivity.
• Compact, serviceable package: 1517-BBGA FCBGA packaging with surface-mount mounting simplifies board-level integration for high-density layouts.
• Commercial temperature rating: Specified 0 °C to 85 °C operating range for standard commercial applications and environments.
• Regulatory compliance: RoHS compliance supports use in regions and designs requiring lead-free components.

Why Choose 5SGXMA7K3F40C3G?

The 5SGXMA7K3F40C3G delivers a combination of large logic capacity, significant embedded memory and high I/O count in a commercial-grade Stratix V GX FPGA. These attributes make it suitable for designers consolidating multiple functions into a single programmable device where on-chip resources and I/O density are critical.

Backed by the Stratix V family documentation, this device is positioned for complex digital systems that require scalable logic resources, on-chip buffering and a compact FCBGA footprint. Its electrical and package specifications provide clear parameters for power delivery and thermal planning in board designs.

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