5SGXMA7K3F40C3
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 654 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7K3F40C3 – Stratix® V GX FPGA, 622,000 logic elements, approximately 51.2 Mbits RAM, 696 I/Os
The 5SGXMA7K3F40C3 is a Stratix V GX field programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA (1517-FBGA, 40×40) package for surface-mount applications. It provides a high-density programmable fabric with a large on-chip memory complement and a very high I/O count for designs that require significant logic capacity and interface density.
As a commercial-grade device with a core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C, this part is intended for applications that demand substantial logic resources and flexible I/O in standard-temperature environments. The device is RoHS compliant.
Key Features
- Logic Capacity Provides 622,000 logic elements suitable for complex digital designs and large-scale FPGA implementations.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, tables, and data-path storage within the FPGA fabric.
- I/O Density 696 user I/Os to accommodate high-pin-count interfaces, multi-channel connectivity, and dense system integration.
- Package & Mounting 1517-BBGA (FCBGA) supplier device package listed as 1517-FBGA (40×40); surface-mount package suited for compact board layouts.
- Power Core voltage supply range of 0.820 V to 0.880 V to align with low-voltage FPGA designs and power planning.
- Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
- Regulatory Compliance RoHS compliant for regulatory and manufacturing considerations.
Typical Applications
- High-density digital systems Use where large-scale programmable logic and significant on-chip memory are required to implement complex state machines, pipelines, or custom accelerators.
- Multi-interface platforms Suitable for systems needing large numbers of I/Os to connect multiple peripherals, high-speed front-ends, or wide parallel buses.
- Compute and data buffering Embedded memory and logic capacity make the device appropriate for applications that perform local data buffering, packet handling, or table-driven logic.
Unique Advantages
- High integration density: 622,000 logic elements and approximately 51.2 Mbits of embedded memory reduce external component needs and enable more functionality on a single FPGA.
- Extensive I/O capability: 696 I/Os allow flexible system partitioning and support for numerous parallel interfaces without multiplexing compromises.
- Compact surface-mount package: 1517-BBGA (1517-FBGA, 40×40) packaging delivers a high pin-count solution in a compact footprint for space-constrained designs.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance to meet standard commercial production requirements.
- Predictable power planning: Core voltage range of 0.820 V–0.880 V supports accurate power budgeting and thermal considerations at the board level.
Why Choose 5SGXMA7K3F40C3?
The 5SGXMA7K3F40C3 delivers a balance of large logic capacity, substantial on-chip memory, and very high I/O density in a compact ball-grid package, making it a strong choice for commercial designs that require substantial programmable resources and flexible interfacing. As a member of the Stratix V GX family, this device is positioned for designs that need high integration and scalable logic fabrics backed by family-level documentation.
Engineers specifying this part benefit from a well-documented device family and a commercial-grade component that supports dense implementations while maintaining predictable power and thermal parameters for board-level integration.
Request a quote or submit a pricing and availability inquiry to receive current lead times and procurement details for part number 5SGXMA7K3F40C3.

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