5SGXMA7K3F40C3WN

The 5SGXMA7K3F40C3WN is a Stratix V GX FPGA from Intel, delivered in a 1517-BBGA FCBGA package for surface-mount assembly. It integrates a very large logic and memory fabric alongside extensive I/O to support high-density, I/O‑rich designs.

Key architectural highlights include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 I/O pins. The device is specified for commercial operation with a core supply range of 0.820–0.880 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• High Logic Density  622,000 logic elements for large-scale combinational and sequential logic implementation.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage.
• Extensive I/O  696 user I/O pins to accommodate wide parallel interfaces and multiple peripheral connections.
• Package and Mounting  1517‑BBGA (1517‑FBGA, 40×40) FCBGA in a surface-mount form factor for compact board-level integration.
• Power and Supply  Core supply specified from 0.820 V to 0.880 V to match system power-rail planning.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial electronics applications.
• Standards and Compliance  RoHS compliant for environmental and manufacturing compliance.
• Series Technical Foundations  The Stratix V series datasheet documents electrical and switching characteristics including transceiver specifications and I/O timing for GX devices.

Typical Applications

• High-density FPGA logic  Implement large, performance‑oriented logic designs that require many logic elements and significant embedded memory.
• I/O‑intensive systems  Drive complex multi‑interface boards and wide parallel buses using the device's 696 I/O pins.
• High-speed serial transceiver designs  Leverage the Stratix V GX family’s documented transceiver capabilities (see series datasheet for supported channel speeds and speed grades) for designs requiring high-rate serial links.
• Commercial embedded products  Deploy in commercial temperature environments where the 0 °C to 85 °C rating and RoHS compliance are required.

Unique Advantages

• Highly integrated logic and memory: Combine 622,000 logic elements with ~51.2 Mbits of embedded RAM to reduce external memory needs and simplify board design.
• Large I/O count: 696 I/O pins enable flexible system partitioning and direct connection to multiple peripherals and parallel interfaces.
• Compact FCBGA package: The 1517‑BBGA FCBGA footprint supports high-density PCB layouts while keeping a small board area.
• Commercial deployment ready: Specified core voltage range and 0 °C to 85 °C operating temperature suit mainstream commercial electronics applications.
• Regulatory-friendly: RoHS compliance aids in meeting environmental and manufacturing requirements.
• Documented series-level transceiver and I/O performance: Series datasheet includes electrical, switching, and transceiver specifications to inform system design and timing analysis.

Why Choose 5SGXMA7K3F40C3WN?

The 5SGXMA7K3F40C3WN positions itself as a high-density Stratix V GX FPGA option for designers needing substantial logic capacity, on-chip memory, and a large complement of I/O in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a broad range of commercial embedded systems where integration density and I/O flexibility are priorities.

With series-level documentation covering electrical characteristics, switching behavior, and transceiver specifications, this device supports engineering workflows that require verifiable timing and power planning. It is well suited to teams building complex, I/O-heavy, and high-performance FPGA-based systems.

To request a quote or submit an inquiry for 5SGXMA7K3F40C3WN, please provide your quantity, required delivery timeframe, and any project-specific requirements to receive pricing and availability information.