5SGXMA7K3F40C3NCV

The 5SGXMA7K3F40C3NCV is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. This device integrates a large logic fabric, substantial on-chip memory, and a high I/O count in a 1517-ball FCBGA package, targeted at complex digital designs that require high integration density and extensive I/O connectivity. It is supplied as a commercial-grade device with a specified operating temperature range of 0 °C to 85 °C.

Key Features

• Core logic capacity — 622,000 logic elements suitable for large-scale programmable logic implementations and complex system designs.
• Embedded memory — approximately 51.2 Mbits of total on-chip RAM to support buffering, packet processing, and intermediate data storage.
• I/O resources — 696 I/O pins to support wide external interfacing and dense board-level connectivity.
• Package and mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40); surface-mount mounting type for standard PCB assembly.
• Power — core voltage supply range of 820 mV to 880 mV for the device core.
• Temperature grade — commercial grade with operating temperature from 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Series-level transceiver capability — Stratix V GX devices are described in the datasheet with GX channel transceiver speed grades (series documentation includes channel speed options up to 14.1 Gbps for GX channels).

Typical Applications

• High-density logic designs — Systems that require hundreds of thousands of logic elements can leverage the 622,000 logic-element fabric to implement large custom logic blocks and state machines.
• I/O-intensive interfaces — Designs needing broad external connectivity can use the 696 I/O pins for parallel buses, multi-channel interfaces, and complex board-level interconnects.
• On-chip buffering and data processing — The device’s approximately 51.2 Mbits of embedded RAM supports frame buffering, packet queues, and intermediate data storage for streaming or burst workloads.

Unique Advantages

• Substantial logic density: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing the need for external logic devices.
• Large embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive external connectivity: 696 I/Os provide flexibility for multi-channel interfaces and dense peripheral integration.
• Commercial temperature support: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• Compact FCBGA package: 1517-BBGA (1517-FBGA 40×40) surface-mount package enables high pin-count mounting in space-constrained designs.
• Standards-compliant supply: RoHS compliance for environmental and manufacturing compatibility.

Why Choose 5SGXMA7K3F40C3NCV?

The 5SGXMA7K3F40C3NCV combines large-scale programmable logic, significant on-chip RAM, and a high I/O count in a single commercial-grade Stratix V GX FPGA package from Intel. Its core voltage range and FCBGA package make it suitable for dense, high-function-count designs that require substantial local memory and broad external interfacing. The device’s specifications align with projects that need integrated logic capacity and memory while remaining within commercial temperature and RoHS constraints.

This FPGA is suited to engineering teams and system designers seeking to consolidate complex functions into a single programmable device, streamline board-level integration, and leverage series-level transceiver capabilities documented for Stratix V GX devices.

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