5SGXMA7K3F40C3N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 444 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K3F40C3N – Stratix® V GX Field Programmable Gate Array (FPGA), 1517-BBGA FCBGA

The 5SGXMA7K3F40C3N is a Stratix V GX field programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA FCBGA (40×40) package for surface-mount applications. It integrates high logic density, extensive I/O, and substantial on-chip memory to address complex, high-density programmable logic designs.

Key on-chip resources include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/Os. The device is specified for commercial-grade operation with a core voltage supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic  Provides 622,000 logic elements suitable for complex, high-density logic implementations and large-scale FPGA designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and scratchpad memory requirements.
  • High I/O Count  696 user I/Os enable broad connectivity to external devices, parallel buses, and high-channel-count interfaces.
  • Transceiver-Class Architecture  Stratix V GX family transceiver capabilities are described in the device documentation, supporting applications that require high-speed serial connectivity.
  • Power and Voltage  Core supply voltage specified between 820 mV and 880 mV to match system power-rail planning for high-performance FPGA cores.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications and environments.
  • Package and Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package for surface-mount assembly and high-pin-count board designs.
  • Standards Compliance  RoHS compliant to support modern manufacturing and environmental requirements.

Typical Applications

  • High-density digital processing  Use the large logic element count and on-chip memory for complex signal processing, custom datapaths, and algorithm acceleration.
  • High-speed serial systems  Leverage the Stratix V GX transceiver-class architecture for designs that require robust, high-throughput serial links.
  • Telecommunications and networking  The combination of high logic capacity and abundant I/Os supports packet processing, switching fabric, and protocol offload functions.
  • Data-path buffering and aggregation  Approximately 51.2 Mbits of embedded RAM enable large buffering and queuing structures for data-centric designs.

Unique Advantages

  • High logic density: 622,000 logic elements provide the capacity for large-scale, multi-function FPGA implementations without immediate migration.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and working-memory needs.
  • Extensive I/O integration: 696 user I/Os give flexible connectivity options for parallel interfaces, mezzanine cards, and multi-channel systems.
  • Commercial-grade availability: Specified for 0 °C to 85 °C operation, suitable for standard commercial product deployments.
  • Compact, high-pin-count package: The 1517-BBGA FCBGA (40×40) package supports dense routing and compact board layouts while providing many I/O and power pins.
  • RoHS compliant: Meets common environmental manufacturing requirements for modern electronics production.

Why Choose 5SGXMA7K3F40C3N?

The 5SGXMA7K3F40C3N combines a large programmable fabric, significant embedded memory, and a high I/O count in a compact, surface-mount FCBGA package—making it well suited for complex digital systems that need both capacity and connectivity. Its Stratix V GX architecture and documented transceiver capabilities address designs requiring high-throughput serial links alongside dense logic.

For commercial product development where substantial on-chip resources, verified electrical characteristics, and RoHS compliance are required, this device offers a balance of performance and integration. It is appropriate for engineers and teams building advanced networking, signal-processing, and data-path systems that benefit from a high-density FPGA solution.

Request a quote or contact sales to discuss availability, lead times, and pricing for the 5SGXMA7K3F40C3N.

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