5SGXMA7K3F40C4

The 5SGXMA7K3F40C4 is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1517‑BBGA FCBGA package. It delivers high on‑chip logic and memory capacity with a large I/O complement, targeted for commercial applications that require dense digital integration and extensive interfacing.

With 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, this device is suitable for designs demanding substantial on‑chip resources, broad connectivity, and controlled core power supply operation.

Key Features

• Logic Capacity — 622,000 logic elements provide abundant programmable logic for complex digital designs; includes 234,720 LABs reported in device data.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM to support large buffer, caching, and algorithmic requirements.
• I/O Resources — 696 general-purpose I/O pins enable extensive peripheral interfacing and multi‑channel connectivity options.
• Package & Mounting — Delivered in a 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40). Surface mount mounting type for PCB assembly.
• Power — Core voltage supply specified at 820 mV to 880 mV for the device core domain.
• Operating Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• High‑density digital processing — Use the device where large logic capacity is required for complex state machines, pipelines, or custom accelerators.
• Memory‑intensive algorithms — Approximately 51.2 Mbits of embedded RAM supports buffers, FIFOs, and on‑chip data storage for DSP or packet processing workloads.
• Connectivity and protocol bridging — 696 I/O pins provide the channel density needed for multi‑lane interfaces, protocol converters, or large peripheral arrays.
• Commercial networking and signal processing — Suited to commercial communications and signal-processing systems that operate within the listed temperature and supply ranges.

Unique Advantages

• Large integrated resource pool: 622,000 logic elements combined with ~51.2 Mbits of RAM reduce the need for external logic and memory, simplifying system BOMs.
• High I/O count: 696 I/O pins enable dense front‑end connectivity and flexible board partitioning for complex systems.
• Compact, board‑ready package: 1517‑BBGA FCBGA in a 40×40 supplier package supports high‑density PCB layouts with surface‑mount assembly.
• Controlled core power: Narrow core voltage range (820–880 mV) facilitates predictable power budgeting in the core domain.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial embedded applications.
• RoHS compliance: Meets common environmental requirements for commercial product assemblies.

Why Choose 5SGXMA7K3F40C4?

The 5SGXMA7K3F40C4 balances substantial programmable logic, significant embedded memory, and a high I/O count in a compact FCBGA package, making it suitable for commercial designs that require on‑chip capacity and broad interfacing. Its defined core voltage range and commercial temperature grade provide predictable integration parameters for system power and thermal planning.

This Stratix V GX device is positioned for engineering teams building complex digital systems—such as communications, signal processing, and high‑density embedded platforms—that need a single, integrated FPGA solution with verified device characteristics and manufacturer support from Intel.

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