5SGXMA7K3F40C2NCV

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 390 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K3F40C2NCV – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA7K3F40C2NCV is an Intel Stratix® V GX family FPGA in a 1517‑BBGA FCBGA package designed for high-density, reprogrammable digital logic. Built for commercial-grade deployments, this device delivers a substantial resource set—including 622,000 logic elements and approximately 51.2 Mbits of embedded memory—suited to complex data-path, protocol, and acceleration designs.

With a 696‑pin I/O count and low-voltage core operation, the device targets applications that require large on-chip capacity and extensive external interfacing while maintaining RoHS compliance and surface-mount PCB assembly compatibility.

Key Features

  • Core Logic  Approximately 622,000 logic elements for implementing large-scale, highly parallel digital designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffer, queue, and algorithmic data storage without external memory in many use cases.
  • I/O Density  696 user I/O pins to support broad external connectivity for interface-rich applications and multi-channel systems.
  • Power and Supply  Core voltage supply range specified at 870 mV to 930 mV, enabling low-voltage core operation consistent with Stratix V GX device requirements.
  • Package and Mounting  1517‑BBGA (1517‑FBGA footprint, 40×40) FCBGA package, designed for surface-mount PCB assembly in compact, high-density layouts.
  • Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
  • Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • High-density digital processing  Use the device where large logic resources and substantial embedded RAM are required for packet processing, signal processing, or custom compute pipelines.
  • Network and communications  Leverage the high I/O count and on-chip memory for multi‑lane interfaces, protocol offload, and aggregation functions.
  • Hardware acceleration and prototyping  Ideal for development of accelerator logic and complex prototypes where reprogrammable capacity and abundant memory simplify iterative design.

Unique Advantages

  • High logic capacity: The large logic element count supports complex, parallel architectures and extensive custom logic integration.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependency on external memory for many buffering and state‑storage needs.
  • Broad external connectivity: 696 I/O pins enable flexible interfacing to multiple peripherals, transceivers, and board-level buses.
  • Low-voltage core operation: Narrow core supply range (870 mV–930 mV) aligns with power-optimized system designs.
  • Compact, assembly-ready package: 1517‑BBGA FCBGA surface-mount package supports dense PCB integration while maintaining mechanical robustness.
  • Commercial-grade reliability: Specified operating range of 0 °C to 85 °C for standard commercial applications and RoHS compliance for manufacturing consistency.

Why Choose 5SGXMA7K3F40C2NCV?

The 5SGXMA7K3F40C2NCV positions itself as a high-capacity Stratix V GX FPGA offering a balance of substantial logic resources, on-chip memory, and extensive I/O in a compact surface-mount BBGA package. It is well suited to engineers and system designers who need a programmable silicon platform capable of accommodating large, interface-rich designs within commercial temperature envelopes.

Backed by Intel Stratix V family documentation and RoHS compliance, the device offers predictable integration into existing production flows and designs that prioritize logic density, embedded memory, and flexible external connectivity.

Request a quote or submit an inquiry to purchase 5SGXMA7K3F40C2NCV and discuss availability, lead times, and volume pricing.

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