5SGXMA7K3F40C2LNCV

The 5SGXMA7K3F40C2LNCV is a Stratix® V GX field programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA FCBGA package. This commercial-grade device provides high logic density and substantial on-chip memory for complex digital designs.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 I/O pins, the device targets designs that require dense logic, large embedded RAM, and extensive I/O. As a Stratix V GX family device, the series supports high-speed transceiver channel options as documented for the family.

Key Features

• Core Logic  622,000 logic elements (cells) to implement large-scale digital functions and complex custom logic.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffers, FIFOs, and intermediate data storage.
• I/O Density  696 user I/O pins to support wide parallel interfaces and multiple peripherals.
• High‑Speed Transceiver Support (family)  Stratix V GX family documentation includes support for high-speed transceiver channel options (family-level specifications up to 14.1 Gbps).
• Power  Core supply operating range from 820 mV to 880 mV, enabling designs that target the specified core-voltage window.
• Package & Mounting  1517-BBGA FCBGA (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor suitable for assembly on standard PCBs.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Deploy the FPGA where large logic capacity and on-chip RAM are required for custom processing pipelines.
• High‑bandwidth interfaces  Use the device in systems that need many I/O and family-level support for high-speed transceiver channels.
• Complex embedded designs  Leverage the combination of logic elements and embedded memory for systems integrating multiple processing blocks and buffers.

Unique Advantages

• High logic capacity:  622,000 logic elements enable large, partitioned designs without immediate need for external logic expansion.
• Substantial on‑chip memory:  Approximately 51.2 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage needs.
• Extensive I/O count:  696 I/O pins allow broad peripheral connectivity and wide data buses for parallel interfaces.
• Surface-mount, high-density package:  1517-BBGA FCBGA (1517-FBGA, 40×40) supports compact board layouts while exposing high pin counts.
• Commercial operating range:  0 °C to 85 °C rating aligns with commercial product and prototype development requirements.
• RoHS compliant:  Complies with RoHS environmental requirements for lead-free manufacturing processes.

Why Choose 5SGXMA7K3F40C2LNCV?

The 5SGXMA7K3F40C2LNCV positions itself where high logic density, large embedded memory, and extensive I/O are required within a commercial-temperature FPGA. As a Stratix V GX device in a 1517-BBGA FCBGA package, it is suited to designers who need substantial on-chip resources and family-level support for high-speed serial channels.

Choosing this FPGA provides a platform that balances logic capacity, memory resources, and I/O connectivity for complex embedded designs and high-bandwidth interfaces, with compliance and operating parameters clearly specified for procurement and systems engineering.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA7K3F40C2LNCV Stratix V GX FPGA.