5SGXMA7K3F35I4N

The 5SGXMA7K3F35I4N is a Stratix V GX family FPGA IC from Intel, offering a high-density programmable fabric for complex digital designs. It combines large logic capacity, substantial embedded memory, and a high I/O count in a 1152-ball FCBGA package targeted at industrial-temperature applications.

This device is suited for designs that need extensive on-chip resources and flexible I/O, including compute- and I/O-intensive systems where integration of logic, memory, and interfaces reduces board-level complexity.

Key Features

• Logic Capacity  622,000 logic elements provide substantial programmable logic for complex algorithms and large-scale state machines.
• Logic Array Blocks (LABs)  234,720 LABs support hierarchical design partitioning and resource distribution across the fabric.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM enables large buffers, FIFOs, and local storage without external memory dependence.
• I/O Resources  432 user I/O pins accommodate wide parallel interfaces and multiple high-pin-count peripherals.
• Package  1152-BBGA (FCBGA) in a 35×35 supplier device footprint for compact, high-density board implementation.
• Power Supply  Core voltage specified between 820 mV and 880 mV to match the device's operating requirements.
• Mounting & Grade  Surface-mount package rated to industrial temperature ranges (–40 °C to 100 °C), suitable for industrial deployments.
• Regulatory  RoHS compliant for alignment with lead-free manufacturing and environmental requirements.

Typical Applications

• High-density digital processing  Leverage the large logic element count and abundant embedded RAM to implement complex DSP pipelines and hardware accelerators.
• Telecommunications and networking  High I/O count and Stratix V GX family capabilities support packet processing, interface bridging, and protocol offload tasks.
• Prototyping and system integration  Large programmable fabric and on-chip memory make the device effective for validating SOC concepts and consolidating multiple functions onto a single FPGA.

Unique Advantages

• High on-chip integration: Consolidates large logic capacity and approximately 51.2 Mbits of embedded memory to reduce external component count and simplify board design.
• Ample I/O flexibility: 432 I/O pins support broad peripheral connectivity and parallel data paths without extensive multiplexing.
• Industrial temperature rating: Specified operation from –40 °C to 100 °C enables deployment in temperature-challenging environments.
• Compact, manufacturable package: 1152-ball FCBGA (35×35) package provides a dense footprint for space-constrained systems while supporting surface-mount assembly.
• Standards-aligned supply and compliance: Defined core voltage range (820–880 mV) and RoHS compliance simplify power planning and environmental conformity.

Why Choose 5SGXMA7K3F35I4N?

The 5SGXMA7K3F35I4N positions itself as a high-capacity Stratix V GX FPGA option for designs that require significant programmable logic, sizable embedded memory, and a high pin count in an industrial-temperature, surface-mount package. Its combination of 622,000 logic elements, roughly 51.2 Mbits of RAM, and 432 I/O pins makes it well suited to consolidate functions and accelerate compute-heavy workloads on a single device.

Engineers selecting this device benefit from the Stratix V family’s device-level characteristics and the Intel (Altera) documented device specifications, enabling scalable design choices and predictable integration for demanding applications.

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