5SGXMA7K3F35I3LN

The 5SGXMA7K3F35I3LN is an Intel Stratix V GX field-programmable gate array supplied in a 1152-BBGA (FCBGA) package. It provides high-density programmable logic and on-chip memory together with a large I/O count for complex system integration in industrial environments.

Designed for applications that require substantial logic capacity, extensive I/O, and operation across a wide temperature range, this device delivers a combination of logic resources, embedded memory, and configurable I/O in a surface-mount FCBGA footprint.

Key Features

• High-density logic: 622,000 logic elements (LEs) to implement large-scale custom logic, state machines, and datapaths.
• Significant embedded memory: Approximately 51 Mbits of on-chip RAM for buffering, FIFOs, and memory-mapped accelerator state.
• Extensive I/O capability: 432 user I/O pins to support complex peripheral interfaces and multi-channel connectivity.
• GX transceiver family (device series): Stratix V GX family information in the device datasheet documents transceiver channel rates up to 14.1 Gbps for supported speed grades, enabling high-speed serial links where required by the design.
• Power supply range: Core voltage supply specified from 820 mV to 880 mV for core power management and board-level planning.
• Industrial operating range: Rated for operation from −40 °C to 100 °C for deployment in industrial temperature environments.
• Package and mounting: 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35 × 35 mm) in a surface-mount form factor for dense system assemblies.
• Regulatory compliance: RoHS compliant.

Typical Applications

• Industrial control and automation: Industrial-grade temperature rating (−40 °C to 100 °C) and abundant I/O make this device suitable for factory automation, motion control interfaces, and machine-vision pre-processing.
• High-speed communications and networking: Stratix V GX family transceiver capability (documented up to 14.1 Gbps in the family datasheet) and 432 I/Os support multi-channel serial links and protocol aggregation.
• Custom acceleration and prototyping: 622,000 logic elements and approximately 51 Mbits of embedded RAM deliver the resources needed for hardware acceleration, algorithm prototyping, and custom dataplane implementations.

Unique Advantages

• High logic capacity: Enables consolidation of multiple functions into a single device, reducing the need for external glue logic.
• Large embedded memory footprint: Approximately 51 Mbits of on-chip RAM reduces dependency on external memory for many buffering and state storage needs.
• Robust industrial operation: Specified −40 °C to 100 °C operation supports deployments in demanding temperature environments.
• Flexible I/O and connectivity: 432 I/Os accommodate diverse interfaces and complex multi-device systems without extensive external multiplexing.
• Surface-mount FCBGA package: 1152-ball FCBGA (35 × 35 mm) provides a compact, high-pin-count option for space-constrained, high-density PCBs.
• RoHS compliant: Meets RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose 5SGXMA7K3F35I3LN?

The 5SGXMA7K3F35I3LN combines large logic capacity, substantial embedded memory, and a high I/O count in an industrial-rated Stratix V GX device from Intel. Its power and thermal operating points, documented transceiver capabilities in the family datasheet, and robust package options make it appropriate for complex, high-performance FPGA designs where density and reliable operation across temperature are required.

This device is well suited for engineers and system designers building industrial systems, high-speed communication nodes, or custom hardware accelerators that require significant on-chip resources and a proven FPGA family roadmap.

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