5SGXMA7K3F35I4G

The 5SGXMA7K3F35I4G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) delivered in a 1152-BBGA (35×35) FCBGA package. It provides very-high logic density and substantial on-chip memory for complex, programmable digital designs.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory and 432 I/Os, this device targets designs that require high logic capacity, large I/O counts and industrial temperature operation.

Key Features

• Core Logic  622,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables and state storage.
• I/O Density  432 general-purpose I/Os to support high-pin-count interfaces and board-level connectivity.
• Package & Mounting  1152-BBGA (FCBGA) 35×35 supplier device package; surface-mount BGA mounting for compact, high-density PCB integration.
• Power  Core supply voltage range 820 mV to 880 mV to match specified power domains.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C.
• Standards & Compliance  RoHS compliant.
• Series Transceiver Capability (series-level)  Datasheet for the Stratix V GX family documents GX transceiver grades (series-level) with channel capabilities up to 14.1 Gbps.

Typical Applications

• High-density digital signal processing  Large logic capacity and extensive on-chip RAM enable implementation of complex DSP algorithms and filter chains.
• High I/O interfacing  432 I/Os provide the pin count needed for multi-channel front-ends, protocol bridging and dense board-level connectivity.
• Industrial systems  Industrial-grade temperature range (−40 °C to 100 °C) suits deployment in rugged or temperature-variable environments.
• FPGA-based prototyping and system integration  The combination of high logic density and abundant memory supports large prototype designs and system-level integration tasks.

Unique Advantages

• High logic capacity: 622,000 logic elements reduce partitioning and allow larger functions to remain on a single device.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM lowers external memory dependence for buffering and state storage.
• Large I/O count: 432 I/Os simplify board-level routing for multi-channel and multi-protocol applications.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports reliability in temperature-challenging deployments.
• Compact, high-density package: 1152-BBGA FCBGA package provides a small PCB footprint while delivering high pin density.
• RoHS compliant: Aligns with lead-free and environmental regulatory requirements.

Why Choose 5SGXMA7K3F35I4G?

The 5SGXMA7K3F35I4G delivers a combination of high logic density, significant embedded memory and a large I/O complement in an industrial-grade Stratix V GX device. These attributes make it well suited for designers who need to consolidate complex logic, memory-intensive functions and extensive interfacing into a single FPGA package.

Backed by device-level documentation for the Stratix V GX family, this FPGA is appropriate for demanding production designs where integration, thermal margin and long-term availability are important considerations.

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