5SGXMB6R1F40C1N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 9 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R1F40C1N – Stratix® V GX Field Programmable Gate Array (FPGA) IC — 597,000 logic elements, 432 I/Os

The 5SGXMB6R1F40C1N is an Intel Stratix® V GX family FPGA supplied in a 1517‑FBGA (40×40) surface‑mount package. It delivers approximately 597,000 logic elements and roughly 53.2 Mbits of embedded RAM, combined with 432 user I/O pins for high‑density digital integration.

Designed as a commercial‑grade device, this FPGA operates from a core supply range of 870 mV to 930 mV and supports an ambient operating temperature range of 0 °C to 85 °C. Its combination of large logic capacity, substantial on‑chip memory, and high I/O count makes it suitable for complex board‑level designs that require dense programmable fabric and on‑chip storage.

Key Features

  • High Logic Capacity  Approximately 597,000 logic elements provide substantial programmable fabric for complex digital functions and large‑scale integration.
  • Embedded Memory  Approximately 53.2 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage without relying solely on external memory.
  • High I/O Count  432 user I/Os for broad interface support and board‑level connectivity to peripherals, interfaces, and high‑pin‑count systems.
  • Package & Mounting  Supplied in a 1517‑FBGA (40×40) package, optimized for surface‑mount assembly and compact board placement.
  • Power and Core Voltage  Core voltage range of 870 mV to 930 mV to match system power domains and enable predictable power planning.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for a broad range of commercial and enterprise applications.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • High‑density digital systems  Use the large logic fabric and embedded memory for complex state machines, datapath processing, and custom accelerators on a single device.
  • Communications and networking equipment  Leverage the high I/O count and on‑chip RAM for board‑level protocol handling, packet buffering, and multi‑lane interfaces.
  • Prototyping and system consolidation  Integrate multiple functions into a single FPGA to reduce board complexity and accelerate hardware validation.

Unique Advantages

  • Large single‑device capacity: The combination of ~597k logic elements and ~53.2 Mbits of RAM enables complex designs without immediate need for multiple FPGAs.
  • Extensive I/O flexibility: 432 I/Os provide the pin count required for dense peripheral interfacing and high‑channel designs.
  • Compact board footprint: The 1517‑FBGA (40×40) package delivers high integration in a surface‑mount form factor suitable for modern PCB layouts.
  • Design predictability: Commercial grade temperature range (0 °C to 85 °C) and defined core voltage range simplify system-level thermal and power planning.
  • Regulatory compliance: RoHS compliance supports environmentally constrained product designs.

Why Choose 5SGXMB6R1F40C1N?

The 5SGXMB6R1F40C1N positions itself as a high‑capacity Stratix V GX FPGA for designs that require substantial programmable logic, meaningful on‑chip RAM, and a large number of I/Os in a compact BGA package. It suits teams consolidating multiple board functions into a single device or implementing large stateful and datapath designs that benefit from embedded memory.

Backed by Intel’s Stratix V family lineage, this commercial‑grade FPGA delivers predictable electrical and thermal parameters, enabling designers to plan power, cooling, and signal‑integrity requirements with confidence while leveraging a mature ecosystem for development and support.

Request a quote or submit an inquiry to evaluate 5SGXMB6R1F40C1N for your next high‑density FPGA design.

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