5SGXMB6R1F40C2G

The 5SGXMB6R1F40C2G is a Stratix V GX series FPGA from Intel supplied in a 1517‑FBGA (40×40) package. It provides a large programmable fabric with extensive on‑chip memory and a high I/O count for complex, board‑level digital designs.

Designed for commercial‑grade applications, this device combines 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 432 I/O pins in a surface‑mount FBGA package. Electrical and switching characteristics for the Stratix V family are documented in the device datasheet.

Key Features

• Logic Capacity  597,000 logic elements (LEs) to implement large-scale programmable logic and custom hardware functions.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive processing.
• I/O Density  432 user I/O pins to interface with multiple peripherals, parallel buses, and board‑level signals.
• Power and Core Voltage  Core supply range of 870 mV to 930 mV, enabling defined power provisioning for the device core.
• Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor for compact PCB integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• Compliance  RoHS‑compliant to meet common environmental and assembly requirements.
• Family Documentation  Stratix V device electrical and switching characteristics are available in the device datasheet for detailed design and timing guidance.

Typical Applications

• High‑density signal processing  Use the large logic capacity and substantial embedded memory to implement complex DSP pipelines and packet processing engines.
• Multi‑channel I/O aggregation  432 I/O pins enable dense interface aggregation, protocol bridging, and custom board‑level control logic.
• FPGA‑based prototyping and integration  The surface‑mount 1517‑FBGA package and commercial temperature rating suit prototype and production PCBs for mainstream electronic products.

Unique Advantages

• High logic density: 597,000 logic elements allow large designs to be implemented within a single device, reducing system complexity.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM provides local buffering and storage for datapath and control logic.
• Large I/O complement: 432 I/O pins support multiple parallel interfaces and high‑pin‑count system connectivity without external glue logic.
• Compact FBGA package: 1517‑FBGA (40×40) enables a space‑efficient footprint while maintaining robust signal routing options on the PCB.
• Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in mainstream electronic products.
• RoHS compliant: Meets common environmental requirements for modern electronics assembly processes.

Why Choose 5SGXMB6R1F40C2G?

The 5SGXMB6R1F40C2G delivers a balance of high logic capacity, generous embedded memory, and a large I/O count in a compact surface‑mount FBGA package tailored for commercial applications. As part of the Stratix V GX family, its electrical and switching characteristics are documented in the device datasheet to support engineering evaluation and system integration.

This device is suited to designs that require significant programmable logic resources and on‑chip memory while maintaining a compact PCB footprint and broad I/O capability. Its specifications support scalable digital designs where integration and predictable operating parameters are important.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMB6R1F40C2G. Our team can provide additional procurement details and assistance specific to your design requirements.