5SGXMB6R1F40C2N

The 5SGXMB6R1F40C2N is a Stratix V GX Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers high-density programmable logic, substantial embedded memory, and a large I/O count in a compact 1517‑FBGA (40×40) surface-mount package.

Designed for applications that require significant on-chip resources, this commercial-grade device combines 597,000 logic elements with approximately 53.25 Mbits of embedded memory and 432 I/O pins, providing a platform for complex digital designs and integration into systems with strict space and pin-count constraints.

Key Features

• Logic Capacity — 597,000 logic elements provide extensive programmable logic resources for complex designs and parallel processing tasks.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffers, lookup tables, and data-path storage without external memory dependency.
• High I/O Count — 432 general-purpose I/O pins to accommodate multiple high-pin-count interfaces and board-level connectivity.
• Low-Voltage Core — Core voltage supply range of 870 mV to 930 mV to meet the device’s power requirements.
• Package & Mounting — 1517‑FBGA (40×40) supplier device package in a surface-mount form factor for compact, high-density board implementation.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance — RoHS-compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

• Complex digital signal processing — Large logic capacity and significant embedded memory enable implementation of advanced DSP algorithms and accelerators.
• High-density interfacing — 432 I/O pins suit applications that require multiplexed interfaces, protocol bridging, or multiple parallel buses.
• System prototyping and integration — The combination of logic, memory, and I/O makes this device suitable for prototyping and integrating large programmable subsystems on a compact PCB footprint.

Unique Advantages

• High integration density: 597,000 logic elements reduce the need for multiple devices, simplifying system architecture.
• Large on-chip memory: Approximately 53.25 Mbits of embedded RAM minimizes external memory requirements and improves data-path efficiency.
• Extensive I/O capability: 432 I/O pins provide flexibility for connecting numerous peripherals and high-pin-count interfaces.
• Compact FBGA package: 1517‑FBGA (40×40) surface-mount package enables high-density board layouts while maintaining manufacturability.
• Commercial-grade operating range: 0 °C to 85 °C supports deployment in standard commercial products and environments.
• Regulatory compliance: RoHS compliance supports lead-free assembly and environmental requirements.

Why Choose 5SGXMB6R1F40C2N?

The 5SGXMB6R1F40C2N offers a balance of high logic density, substantial embedded memory, and broad I/O capability in a compact FBGA package, making it a strong fit for demanding programmable-logic designs that require on-chip resources and a small board footprint. As a Stratix V GX device from Intel, it is documented within the Stratix V device datasheet set, providing the electrical and switching characteristics engineers rely on during design.

This FPGA is well suited for teams building complex digital systems, high-density interfaces, and prototypes that benefit from integrated memory and a high count of I/Os, while maintaining compliance needs such as RoHS and operating across commercial temperature ranges.

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