5SGXMB6R1F40I2LN

The 5SGXMB6R1F40I2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade implementations. It provides a large on-chip logic capacity and significant embedded memory, paired with a high I/O count and a compact 1517-FBGA (40×40) surface-mount package.

This device is targeted at designs that require substantial logic resources, abundant I/O connectivity, and operation across a wide industrial temperature range. Key value propositions include high integration density, substantial embedded RAM, and a low-voltage core supply range suitable for modern FPGA power architectures.

Key Features

• Core Capacity — 597,000 logic elements and 225,400 logic array blocks provide extensive resources for complex digital designs.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM supports large buffering, LUT-based structures, and memory-intensive algorithms.
• I/O Resources — 432 general-purpose I/O pins for broad interface flexibility and parallel connectivity.
• Power Supply — Core voltage supply range of 820 mV to 880 mV to match contemporary low-voltage FPGA power architectures.
• Package & Mounting — 1517-FBGA (40×40) package in a surface-mount format for compact board-level integration.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control & Automation — High logic capacity and industrial temperature rating support real-time control, motion control, and factory automation systems.
• Data Processing & Signal Processing — Large embedded memory and extensive logic resources enable complex DSP pipelines and packet processing engines.
• Communications Infrastructure — High I/O count and Stratix V GX family attributes suit switching, routing, and protocol-bridging implementations.

Unique Advantages

• High Integration Density: Nearly 600k logic elements reduce the need for multiple devices, simplifying board design and lowering BOM count.
• Substantial On-Chip RAM: Approximately 53.25 Mbits of embedded memory enables large buffers and efficient on-chip data storage.
• Robust I/O Count: 432 I/Os provide ample connectivity for parallel interfaces, mixed signaling, and external peripherals.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact, Surface-Mount Packaging: 1517-FBGA (40×40) package allows space-efficient integration while supporting high pin count.
• Low-Voltage Core Supply: 820 mV to 880 mV core supply range aligns with modern power design practices for efficient operation.

Why Choose 5SGXMB6R1F40I2LN?

The 5SGXMB6R1F40I2LN delivers a combination of high logic density, significant embedded memory, and extensive I/O in a compact industrial-grade FBGA package. It is well suited to engineers building complex, memory- and logic-intensive systems that must operate across a wide temperature range and integrate tightly on space-constrained PCBs.

For designs requiring scalable logic resources, robust on-chip RAM, and a high pin count in an industrial-rated device, this Stratix® V GX FPGA offers a clear, specification-driven choice that supports demanding embedded and infrastructure applications.

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