5SGXMB6R1F43C1G

The 5SGXMB6R1F43C1G is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, supplied in a 1760-FCBGA (42.5 × 42.5 mm) package for surface-mount applications. It provides high logic and I/O density for designs that require substantial on-chip resources and broad interfacing capability.

This device offers 597,000 logic elements, approximately 53 Mbits of embedded memory, and 600 I/O pins, making it suited to applications that need large programmable logic capacity, extensive I/O connectivity, and low-voltage core operation (870 mV to 930 mV). It is offered in a commercial temperature grade (0 °C to 85 °C) and is RoHS compliant.

Key Features

• Logic and Fabric  597,000 logic elements combined with 225,400 logical blocks provide extensive programmable fabric for complex logic and datapath implementations.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM (53,248,000 bits) to support buffering, FIFOs, and local storage for high-throughput designs.
• I/O Capacity  600 I/O pins enable wide parallel interfaces and extensive connectivity to peripherals, memory, and external logic.
• Package and Mounting  1760-BBGA / 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-density board designs.
• Power and Voltage  Core supply range of 870 mV to 930 mV for low-voltage operation; suitable for designs targeting modern low-voltage FPGA cores.
• Temperature and Grade  Commercial grade with an operating range of 0 °C to 85 °C for standard commercial applications.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-performance signal processing  Leverage 597,000 logic elements and ~53 Mbits of embedded memory to implement complex DSP pipelines and real‑time processing engines.
• Protocol bridging and I/O aggregation  600 I/Os support wide parallel interfaces and protocol conversion between multiple subsystems or high-pin-count peripherals.
• Custom compute acceleration  Large logic capacity and on-chip RAM enable hardware acceleration blocks and custom compute kernels within server or appliance designs.

Unique Advantages

• High logic density: 597,000 logic elements provide the capacity to integrate multiple subsystems and sizable custom logic blocks on a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 53 Mbits of on-chip RAM reduces dependence on external memory for many buffering and caching needs, improving latency and system integration.
• Extensive I/O count: 600 I/Os allow flexible interface options and support for broad connectivity requirements without additional I/O expanders.
• Compact, industry-standard package: 1760-FCBGA packaging delivers a high-pin-count solution in a compact footprint for dense PCB layouts.
• Low-voltage core operation: Core supply range of 870–930 mV supports modern low-voltage system designs, enabling optimized power profiles.
• RoHS compliant: Conforms to RoHS requirements for environmentally compliant manufacturing.

Why Choose 5SGXMB6R1F43C1G?

The 5SGXMB6R1F43C1G positions itself as a high-capacity, high-I/O Stratix V GX FPGA for commercial applications that demand large programmable logic, significant embedded memory, and broad interfacing. Its combination of 597,000 logic elements, approximately 53 Mbits of on-chip RAM, and 600 I/Os makes it well suited for complex signal processing, protocol bridging, and custom acceleration tasks where integration and board-level consolidation are priorities.

Designed for surface-mount deployment in a 1760-FCBGA package and operating within a commercial temperature range (0 °C to 85 °C), this device delivers a balance of density, connectivity, and power characteristics appropriate for advanced commercial electronic designs.

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