5SGXMB6R1F43C1N

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA

Quantity 1,593 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMB6R1F43C1N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMB6R1F43C1N is a Stratix® V GX family FPGA from Intel designed for high-density programmable logic applications. It combines a large logic fabric with substantial on-chip RAM and extensive I/O to support complex digital designs that require significant integration.

As a Stratix V GX device, the part is described in the device datasheet with electrical and switching characteristics, including transceiver and I/O timing information applicable to the GX architecture. This specific device is offered in a commercial temperature grade and a 1760-FCBGA package.

Key Features

  • Logic Capacity  Approximately 597,000 logic elements (logic cells) to implement large, complex logic designs.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for data buffering, lookup tables, and embedded storage.
  • I/O Count  600 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
  • Package  1760-FCBGA (42.5 × 42.5 mm) BGA package for high-pin-count board integration and dense routing.
  • Power and Voltage  Core voltage supply range specified at 870 mV to 930 mV to match Stratix V GX core requirements.
  • Temperature Grade  Commercial operating range from 0 °C to 85 °C.
  • Family-Level Transceiver Support  Built on the Stratix V GX architecture; device-level electrical and transceiver speed grades are documented in the Stratix V device datasheet.
  • RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

  • High-density programmable logic systems  Systems that require approximately 597,000 logic elements and substantial embedded memory for complex FPGA implementations.
  • Platform integration  Designs needing up to 600 I/O pins and a high-pin-count FCBGA package for multi-interface boards and mezzanine-style integrations.
  • Memory-intensive processing  Applications that leverage approximately 53.25 Mbits of on-chip RAM for buffering, packet storage, or large LUT-based functions.

Unique Advantages

  • High logic density: Approximately 597,000 logic elements enable large-scale integration of functions into a single device, reducing external component count.
  • Significant embedded memory: Approximately 53.25 Mbits of on-chip RAM supports data-heavy algorithms and internal buffering without external memory.
  • Extensive I/O capability: 600 I/O pins provide flexibility for wide parallel buses, multiple interfaces, and significant peripheral connectivity.
  • Compact high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) delivers a dense pinout for complex board designs while maintaining a compact footprint for its class.
  • Controlled core supply range: Specified 870–930 mV core voltage ensures compatibility with Stratix V GX core-level power requirements.
  • Commercial temperature rating: 0 °C to 85 °C operation suits a broad range of standard commercial electronic products.

Why Choose 5SGXMB6R1F43C1N?

The 5SGXMB6R1F43C1N brings high integration and memory capacity within the Stratix V GX family, making it suitable for designs that demand large programmable logic arrays, substantial on-chip RAM, and broad I/O. Its 1760-FCBGA package and core voltage specification allow designers to incorporate dense, high-functionality FPGA capability into complex systems while remaining within commercial temperature bounds.

Backed by Intel’s Stratix V device documentation and datasheet information, this device is appropriate for development teams and procurement seeking a high-density FPGA solution aligned with documented electrical and switching characteristics.

If you need pricing, lead-time, or additional technical details for design planning, request a quote or submit your requirements to initiate a sales inquiry.

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