5SGXMB6R1F43C2G

The 5SGXMB6R1F43C2G is an Intel Stratix® V GX field-programmable gate array supplied in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package. It provides very large logic capacity, substantial on-chip RAM, and extensive I/O for demanding commercial-temperature FPGA designs.

With 597,000 logic elements, approximately 53.2 Mbits of embedded memory, and 600 I/O pins, this device targets high-density digital designs that require significant integration of logic, memory, and I/O resources while operating within the commercial temperature range.

Key Features

• Core logic capacity — 597,000 logic elements delivering very high gate-count capability for complex designs.
• Logic array resources — 225,400 logic array blocks (LABs) to organize and scale large designs efficiently.
• Embedded memory — Approximately 53.2 Mbits of on-chip RAM to support large data buffers, state storage, and memory-intensive functions.
• I/O connectivity — 600 I/O pins to support wide parallel interfaces, multi-channel I/O routing, and rich system interconnects.
• Power requirement — Core voltage supply range of 870 mV to 930 mV for the device core.
• Package & mounting — 1760-FCBGA (42.5 × 42.5 mm) supplier device package in a surface-mount ball grid array footprint.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation.
• Regulatory — RoHS compliant.

Typical Applications

• Complex FPGA-based designs — Suited for systems requiring hundreds of thousands of logic elements and multi-megabit on-chip RAM for data path and control logic implementation.
• Large I/O systems — Ideal for applications that need extensive parallel or multi-channel I/O connectivity supported by 600 I/O pins.
• Memory-intensive functions — Useful where substantial embedded RAM (approximately 53.2 Mbits) is required for buffering, packet storage, or large state machines.

Unique Advantages

• High logic density: 597,000 logic elements enable implementation of large, complex algorithms and multi-function systems on a single device.
• Significant embedded memory: Approximately 53.2 Mbits of RAM reduces external memory needs and simplifies board-level designs.
• Extensive I/O count: 600 I/O pins provide flexibility for wide interfaces, parallel buses, and multi-channel connectivity without multiplexing compromises.
• Compact FCBGA packaging: 1760-FCBGA (42.5 × 42.5 mm) supplies a high-pin-count solution in a standardized surface-mount footprint for dense PCB layouts.
• Commercial grade operation: Rated for 0 °C to 85 °C to meet standard commercial environmental requirements.
• RoHS compliance: Meets lead-free manufacturing and regulatory requirements for commercial electronics production.

Why Choose 5SGXMB6R1F43C2G?

The 5SGXMB6R1F43C2G delivers a combination of very large logic capacity, substantial embedded memory, and broad I/O resources in a single commercial-temperature Stratix V GX device. It is a practical choice for teams implementing large-scale FPGA designs that need to consolidate functions onto one device while maintaining a compact FCBGA package.

Backed by Intel's Stratix V family documentation and datasheet guidance, this device supports scalable development workflows and long-term design stability for commercial applications that require high integration and verified device specifications.

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