AX250-FGG484M

The AX250-FGG484M is an Axcelerator field programmable gate array (FPGA) from Microchip Technology built on the AX antifuse architecture. It delivers nonvolatile, single-chip programmable logic with system-level features including segmentable clocks, embedded PLLs and on-chip SRAM/FIFO control logic.

With 250,000 equivalent system gates, 248 user I/Os and military-grade qualification, the AX250-FGG484M addresses designs that require high performance, deterministic timing and secure programming in a compact 484‑BGA footprint.

Key Features

• Core Architecture  AX antifuse-based architecture offering a single-chip, nonvolatile solution with up to 250,000 equivalent system gates and deterministic, user-controllable timing.
• Logic Capacity  Approximately 4,224 logic elements (modules/registers and combinatorial cells) to implement mid-density logic functions.
• Embedded Memory  Approximately 55 kbits of embedded RAM/FIFO (55,296 total bits) with variable-aspect RAM blocks and programmable embedded FIFO control logic.
• I/O Flexibility  248 user I/Os with support for mixed-voltage operation and differential standards including LVDS (700 Mb/s capable); I/O banks and programmable drive/slew control provide interface flexibility.
• Clocking and PLLs  Segmentable clock resources plus embedded PLLs supporting a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for flexible clock management.
• Performance  Datasheet-documented system and internal performance characteristics (350+ MHz system performance and 500+ MHz internal performance) for high-speed designs.
• Security  FuseLock™ programming technology to protect against reverse engineering and design theft.
• Power and Supply  Core voltage supply range of 1.425 V to 1.575 V for compatible low-voltage system designs.
• Package and Mounting  484‑ball BGA (484‑FPBGA, 23 × 23) surface-mount package for compact board-level integration.
• Environmental Range  Military-grade operating temperature from −55 °C to 125 °C.

Typical Applications

• High-speed serial I/O systems  Leverage LVDS-capable I/Os and high internal performance for multi-channel, high-throughput interfaces.
• Secure aerospace and defense designs  Military-grade temperature range combined with FuseLock programming supports secure, ruggedized applications.
• Embedded memory buffering and FIFOs  On-chip RAM and programmable FIFO control simplify data staging and flow control in packet or stream processing.
• Clocking-intensive digital systems  Segmentable clocks and integrated PLLs enable complex clock domains and frequency synthesis for synchronized subsystems.

Unique Advantages

• Nonvolatile single-chip solution: Eliminates the need for external configuration memory while providing one-time programmable antifuse reliability.
• Secure programming with FuseLock™: Protects intellectual property by preventing reverse engineering and unauthorized readback.
• Integrated clock and PLL resources: On-chip PLLs and segmentable clocks reduce external clocking complexity and enable precise timing control.
• Mixed-voltage, bank-selectable I/Os: Support for multiple I/O standards and programmable drive strength simplifies multi-domain interfacing.
• Designed for harsh environments: Military-grade temperature rating (−55 °C to 125 °C) supports deployment in demanding applications.
• Compact BGA packaging: 484‑ball FPBGA (23 × 23) package enables dense board-level integration without sacrificing I/O count.

Why Choose AX250-FGG484M?

The AX250-FGG484M combines a secure, nonvolatile antifuse FPGA architecture with mid-range logic capacity, embedded memory, and flexible I/O capabilities to serve applications that require deterministic timing and robust system-level features. Its integrated PLLs, segmentable clocks and programmable I/O make it suitable for designs that demand high internal performance and precise timing control.

This device is well suited for engineers and programs targeting secure, high-performance applications in challenging temperature environments, offering a balance of logic resources, embedded RAM/FIFO capability and a compact 484‑BGA form factor.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the AX250-FGG484M.