AX250-FGG484I

IC FPGA 248 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

Quantity 381 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-FGG484I – Axcelerator Field Programmable Gate Array (FPGA) IC, 250,000 gates, 248 I/Os, 484-BGA

The AX250-FGG484I is an Axcelerator antifuse FPGA from Microchip Technology built on the AX architecture. It delivers high-performance, nonvolatile single-chip programmable logic with significant I/O density and embedded memory for demanding embedded and security-sensitive systems.

Designed for applications requiring high internal and system clock performance, deterministic timing, and integrated FIFO/memory support, this device targets high-speed interfaces, data processing, and system-level integration where performance and on-chip security are important.

Key Features

  • Core & Performance: 250,000 equivalent system gates and 4,224 logic elements provide substantial programmable logic capacity. Datasheet-referenced system performance capabilities include 350+ MHz system and 500+ MHz internal performance.
  • Embedded Memory & FIFOs: Approximately 55 kbits (55,296 bits) of embedded RAM with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for width-configurable read/write ports and embedded FIFO use.
  • I/O Capacity & Standards: 248 user I/Os with support for high-speed differential and single-ended standards, including LVDS (700 Mb/s capable), LVPECL and multiple voltage references. Bank-selectable mixed-voltage I/Os support 1.5V, 1.8V, 2.5V and 3.3V operation.
  • Clocking & PLLs: Segmentable clock resources and embedded PLLs with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz enable flexible clocking and high-frequency operation.
  • Power & Supply: Core supply specified at 1.425 V to 1.575 V (nominal 1.5 V core) for low-power core operation.
  • Package & Mounting: Surface-mount 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) package suitable for compact board-level integration.
  • Reliability & Security: Single-chip, nonvolatile antifuse solution with FuseLock programming technology to protect against reverse engineering, plus JTAG boundary-scan testing (IEEE 1149.1) for testability.
  • Industrial Temperature Grade: Rated for operation from −40 °C to +85 °C and RoHS compliant for environmental compatibility.

Typical Applications

  • High-speed data interfaces: LVDS-capable I/Os and embedded FIFOs enable robust handling of serial and parallel high-throughput links and protocol bridging.
  • Secure embedded systems: Antifuse nonvolatile programming and FuseLock technology help protect sensitive logic and IP in security-conscious applications.
  • Communications and networking: Integrated PLLs, segmentable clocks and abundant I/O support system timing and interface requirements for networking equipment and telecom modules.
  • Custom logic and system integration: Large logic element count and on-chip RAM make the device suitable for replacing or prototyping ASIC functionality in embedded designs.

Unique Advantages

  • Nonvolatile single-chip solution: Antifuse programming provides persistent configuration without external configuration memory, simplifying system boot and security.
  • High-performance timing: Documented internal and system frequency capabilities plus embedded PLLs enable high-speed designs with deterministic timing.
  • Flexible I/O and mixed-voltage support: Bank-selectable I/Os and multiple supported I/O standards reduce the need for level-shifting and expand interface options.
  • Embedded FIFOs and configurable RAM: On-chip RAM blocks with programmable FIFO control streamline data buffering and width conversions without external memory.
  • Design security features: FuseLock programming technology and a nonvolatile antifuse process help protect intellectual property against reverse engineering.
  • Industrial temperature operation: Rated for −40 °C to +85 °C, suitable for industrial-grade deployments requiring wider operating temperature ranges.

Why Choose AX250-FGG484I?

The AX250-FGG484I combines a substantial FPGA fabric, flexible and high-speed I/O, on-chip RAM/FIFO resources, and antifuse-based nonvolatile configuration to deliver a compact, integrated solution for high-performance embedded and security-sensitive systems. Its combination of deterministic timing, PLL-based clock synthesis, and embedded memory makes it well-suited for applications that require tight timing control and robust data buffering on-chip.

This device is a fit for engineers and system designers who need a nonvolatile, high-performance FPGA with broad I/O support and industrial temperature capability, providing a balance of integration, performance, and design security backed by Microchip’s Axcelerator family features.

Request a quote or submit an inquiry to check availability, pricing, and lead times for the AX250-FGG484I.

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