AX250-FGG256M

IC FPGA 138 I/O 256FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA

Quantity 913 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case256-LBGANumber of I/O138Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-FGG256M – Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA

The AX250-FGG256M is an Axcelerator antifuse FPGA from Microchip Technology implementing the AX architecture. This nonvolatile, single-chip FPGA delivers 250,000 equivalent system gates with 4,224 logic elements and 55,296 bits of embedded RAM, built on a 0.15 μm CMOS antifuse process with seven metal layers.

Designed for applications that require high internal performance and security, the device offers high-speed internal and system performance, flexible multi-standard I/Os and embedded FIFO support. Its military-grade temperature range and RoHS compliance make it suitable for demanding environments where reliability and IP protection are priorities.

Key Features

  • Core Capacity and Logic — 250,000 equivalent system gates and 4,224 logic elements provide mid-range programmable capacity for complex logic integration.
  • Embedded Memory & FIFO — 55,296 total RAM bits with variable-aspect RAM blocks and programmable embedded FIFO control logic for efficient data buffering and throughput.
  • I/O Flexibility — 138 user I/Os with support for multi-standard operation (1.5V, 1.8V, 2.5V, 3.3V) and high-speed interfaces; LVDS-capable I/Os rated up to 700 Mb/s per the device family description.
  • Clocking and Timing — Segmentable clock resources and embedded PLLs (14–200 MHz input range, frequency synthesis up to 1 GHz) enable deterministic, user-controllable timing.
  • Security and Programming — Antifuse, single-chip nonvolatile architecture with FuseLock programming technology to protect design IP against reverse engineering.
  • Performance — Family-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance as specified for Axcelerator devices.
  • Power and Operating Range — Core voltage range 1.425 V to 1.575 V; operating temperature range −55 °C to 125 °C (military grade).
  • Package and Mounting — Supplied in a 256-LBGA package (supplier package 256-FPBGA, 17×17) with surface-mount mounting type; RoHS-compliant.

Typical Applications

  • Military and Defense Systems — Military-grade temperature rating and nonvolatile antifuse architecture make the device suitable for control, signal processing and secure logic in defense electronics.
  • High-Speed Data Interfaces — LVDS-capable I/Os and embedded FIFO control logic support high-throughput serial and parallel interfaces for communications and data acquisition systems.
  • Deterministic Embedded Control — Segmentable clocks, embedded PLLs and deterministic timing support real-time control, timing-critical signal processing and embedded system orchestration.
  • Secure, Single-Chip Implementations — FuseLock programming and nonvolatile antifuse technology enable hardware-level IP protection for secure deployments.

Unique Advantages

  • Nonvolatile, Single-Chip Solution — Antifuse programming delivers a permanent, single-chip implementation without the need for external configuration memory.
  • High Internal and System Performance — Documented family performance of 500+ MHz internal and 350+ MHz system operation supports demanding timing budgets.
  • Flexible Multi-Standard I/Os — Bank-selectable I/Os and support for multiple voltage standards enable mixed-voltage designs and broad interface compatibility.
  • Integrated Memory and FIFO Control — Embedded RAM blocks with programmable FIFO control reduce external memory needs and simplify data path design.
  • Robust Environmental Range — Military-grade operating temperature (−55 °C to 125 °C) and RoHS compliance support deployment in harsh and regulated environments.
  • IP Protection — FuseLock programming technology protects against reverse engineering and design theft, supporting secure product development.

Why Choose AX250-FGG256M?

The AX250-FGG256M is positioned for designers who need a secure, mid-capacity FPGA that combines nonvolatile antifuse programming with high internal performance and flexible I/O. With 250,000 equivalent system gates, 4,224 logic elements, 138 user I/Os and 55,296 bits of embedded RAM, it provides a balanced mix of logic, memory and I/O resources for complex, timing-sensitive designs.

Its military-grade temperature range, embedded PLLs, deterministic timing resources and FuseLock security make it well suited to defense, aerospace and other demanding applications where long-term robustness, IP protection and predictable performance are required.

Request a quote or submit an inquiry to receive pricing and lead-time information for the AX250-FGG256M.

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