AX250-FG484M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA |
|---|---|
| Quantity | 15 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-FG484M – Axcelerator FPGA, 484‑BGA, Military Grade
The AX250-FG484M is a field-programmable gate array (FPGA) from Microchip Technology’s Axcelerator family, built on the AX antifuse CMOS architecture. This single-chip, nonvolatile FPGA delivers mid-range logic capacity with high I/O density and embedded SRAM/FIFO resources for designs that require deterministic timing and secure programming.
Targeted at military and other high-reliability applications, the device combines 250,000 equivalent system gates, 4,224 logic elements, and approximately 55 kbits of embedded memory with wide operating temperature and a 484-ball fine BGA package for surface-mount assembly.
Key Features
- Core Architecture AX antifuse-based architecture providing a single-chip, nonvolatile solution and design security via FuseLock programming technology.
- Logic Capacity 250,000 equivalent system gates and 4,224 logic elements for mid-density logic implementation.
- Embedded Memory Approximately 55 kbits (55,296 bits) of on-chip SRAM/FIFO, with embedded FIFO control logic capabilities.
- I/O and Interfaces 248 user I/Os with support for high-speed differential signaling; family-level I/O capability includes up to 700 Mb/s LVDS operation and multi-standard, bank-selectable I/Os.
- Clocking and Timing Segmentable clock resources and embedded PLLs; family-level PLL input range 14–200 MHz and frequency synthesis capabilities up to 1 GHz for flexible clock management.
- Power 1.5 V core supply range specified at 1.425 V to 1.575 V to match low-voltage system designs.
- Package & Mounting 484-ball FPBGA (23 × 23 mm) package, surface-mount mounting for compact board-level integration.
- Temperature & Grade Military-grade qualification with operating temperature range from −55 °C to 125 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Military & Defense Systems — Deterministic timing, secure antifuse programming, and extended temperature range make the AX250-FG484M suitable for processing, control, and protocol conversion in rugged defense applications.
- High‑Speed Data Links — 248 I/Os and family-level LVDS capability up to 700 Mb/s support high-throughput serial and parallel interfaces for communication subsystems.
- Embedded Signal Processing — On-chip SRAM/FIFO and PLL resources enable buffering and clocking required for DSP pipelines and real-time data handling.
- Protocol Bridging & I/O Expansion — Dense I/O and multi-standard bank-selectable interfaces allow integration of mixed-voltage peripherals and protocol conversion on a single FPGA.
Unique Advantages
- Secure, Nonvolatile Programming: Antifuse-based single-chip configuration eliminates the need for external configuration memory and protects designs from reverse engineering.
- Military-Grade Reliability: Specified for −55 °C to 125 °C operation, supporting deployment in harsh and mission-critical environments.
- High I/O Density: 248 user I/Os in a 484-ball fine-pitch BGA package enable complex system interfacing while minimizing board footprint.
- Deterministic Timing and Clock Flexibility: Segmentable clocks and embedded PLLs provide precise, user-controllable timing for synchronous system designs.
- Embedded Memory with FIFO Control: Approximately 55 kbits of on-chip SRAM and embedded FIFO control logic reduce external memory requirements and simplify data buffering.
- RoHS Compliant: Meets environmental compliance requirements for eco-conscious procurement.
Why Choose AX250-FG484M?
The AX250-FG484M positions itself as a robust mid-density FPGA that balances logic capacity, embedded memory, and high I/O count within a military-grade, surface-mount 484‑FPBGA package. Its antifuse, single-chip architecture offers secure nonvolatile programming and deterministic timing—attributes valued in defense, aerospace, and other high-reliability systems.
This device is well suited for engineers designing systems that require secure configuration, high-speed I/O, and operation across extreme temperatures, while leveraging embedded SRAM/FIFO resources and flexible clocking available across the Axcelerator family.
Request a quote or submit a request for pricing and availability to get design-level support and lead-time information for the AX250-FG484M.

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