AX250-FG484M

IC FPGA 248 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

Quantity 15 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-FG484M – Axcelerator FPGA, 484‑BGA, Military Grade

The AX250-FG484M is a field-programmable gate array (FPGA) from Microchip Technology’s Axcelerator family, built on the AX antifuse CMOS architecture. This single-chip, nonvolatile FPGA delivers mid-range logic capacity with high I/O density and embedded SRAM/FIFO resources for designs that require deterministic timing and secure programming.

Targeted at military and other high-reliability applications, the device combines 250,000 equivalent system gates, 4,224 logic elements, and approximately 55 kbits of embedded memory with wide operating temperature and a 484-ball fine BGA package for surface-mount assembly.

Key Features

  • Core Architecture AX antifuse-based architecture providing a single-chip, nonvolatile solution and design security via FuseLock programming technology.
  • Logic Capacity 250,000 equivalent system gates and 4,224 logic elements for mid-density logic implementation.
  • Embedded Memory Approximately 55 kbits (55,296 bits) of on-chip SRAM/FIFO, with embedded FIFO control logic capabilities.
  • I/O and Interfaces 248 user I/Os with support for high-speed differential signaling; family-level I/O capability includes up to 700 Mb/s LVDS operation and multi-standard, bank-selectable I/Os.
  • Clocking and Timing Segmentable clock resources and embedded PLLs; family-level PLL input range 14–200 MHz and frequency synthesis capabilities up to 1 GHz for flexible clock management.
  • Power 1.5 V core supply range specified at 1.425 V to 1.575 V to match low-voltage system designs.
  • Package & Mounting 484-ball FPBGA (23 × 23 mm) package, surface-mount mounting for compact board-level integration.
  • Temperature & Grade Military-grade qualification with operating temperature range from −55 °C to 125 °C for deployment in demanding environments.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Military & Defense Systems — Deterministic timing, secure antifuse programming, and extended temperature range make the AX250-FG484M suitable for processing, control, and protocol conversion in rugged defense applications.
  • High‑Speed Data Links — 248 I/Os and family-level LVDS capability up to 700 Mb/s support high-throughput serial and parallel interfaces for communication subsystems.
  • Embedded Signal Processing — On-chip SRAM/FIFO and PLL resources enable buffering and clocking required for DSP pipelines and real-time data handling.
  • Protocol Bridging & I/O Expansion — Dense I/O and multi-standard bank-selectable interfaces allow integration of mixed-voltage peripherals and protocol conversion on a single FPGA.

Unique Advantages

  • Secure, Nonvolatile Programming: Antifuse-based single-chip configuration eliminates the need for external configuration memory and protects designs from reverse engineering.
  • Military-Grade Reliability: Specified for −55 °C to 125 °C operation, supporting deployment in harsh and mission-critical environments.
  • High I/O Density: 248 user I/Os in a 484-ball fine-pitch BGA package enable complex system interfacing while minimizing board footprint.
  • Deterministic Timing and Clock Flexibility: Segmentable clocks and embedded PLLs provide precise, user-controllable timing for synchronous system designs.
  • Embedded Memory with FIFO Control: Approximately 55 kbits of on-chip SRAM and embedded FIFO control logic reduce external memory requirements and simplify data buffering.
  • RoHS Compliant: Meets environmental compliance requirements for eco-conscious procurement.

Why Choose AX250-FG484M?

The AX250-FG484M positions itself as a robust mid-density FPGA that balances logic capacity, embedded memory, and high I/O count within a military-grade, surface-mount 484‑FPBGA package. Its antifuse, single-chip architecture offers secure nonvolatile programming and deterministic timing—attributes valued in defense, aerospace, and other high-reliability systems.

This device is well suited for engineers designing systems that require secure configuration, high-speed I/O, and operation across extreme temperatures, while leveraging embedded SRAM/FIFO resources and flexible clocking available across the Axcelerator family.

Request a quote or submit a request for pricing and availability to get design-level support and lead-time information for the AX250-FG484M.

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