AX250-FGG256I

The AX250-FGG256I is an Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture. It delivers a single-chip, nonvolatile FPGA solution optimized for industrial applications, offering deterministic timing, embedded memory with FIFO control, segmentable clocks and on-chip PLLs.

Targeted at designs that require reliable, high-performance programmable logic in industrial temperature ranges, this device combines approximately 250,000 gates, 4,224 logic elements and roughly 55 kbits of embedded RAM with 138 user I/Os in a 256‑ball LBGA package.

Key Features

• Core Capacity — Approximately 250,000 equivalent system gates and 4,224 logic elements provide mid-range programmable logic density for control, data-path and glue-logic functions.
• Embedded Memory & FIFOs — Total on-chip RAM of 55,296 bits (approximately 55 kbits) with embedded FIFO control logic for buffering and width-configurable read/write ports.
• I/O Resources — 138 user I/Os with support for high-speed signaling; family-level capability includes LVDS up to 700 Mb/s and bank-selectable multi-voltage operation.
• Clocking & PLL — Segmentable clock resources with an embedded PLL supporting a 14–200 MHz input range and frequency synthesis up to 1 GHz (family-level specification).
• Performance — Series-level performance targets include 350+ MHz system performance and 500+ MHz internal performance for latency-sensitive logic paths.
• Nonvolatile Antifuse Technology — Single-chip, nonvolatile solution with FuseLock programming technology to protect against reverse engineering and enable secure configuration.
• Package & Mounting — 256-LBGA surface-mount package (supplier package 256-FPBGA, 17×17 mm) suitable for compact board integration.
• Power & Temperature — Core supply range 1.425 V to 1.575 V; industrial operating temperature from −40 °C to 85 °C.
• Standards & Testability — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug support (Microchip Silicon Explorer II, family-level).
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control & Automation — Implement deterministic control logic, protocol bridging and sensor/interface aggregation within industrial temperature ranges.
• High-Speed Data Interfaces — Use embedded FIFOs and LVDS-capable I/Os for buffering and transporting high-rate serial or parallel data streams.
• Communications & Networking — Offload packet processing, glue logic and timing-critical functions using the device’s PLLs and segmentable clocks.
• Test & Measurement — Create reliable, nonvolatile measurement and acquisition modules that require repeatable timing and embedded buffering.

Unique Advantages

• Deterministic, Nonvolatile Design: Antifuse-based single-chip configuration provides stable, one-time programmable logic with FuseLock protection for IP security.
• Integrated Memory and FIFO Control: On-chip RAM and programmable FIFO logic reduce external memory requirements and simplify board-level buffering designs.
• Flexible I/O and Clocking: Bank-selectable I/Os and segmentable clocks with an on-chip PLL simplify mixed-voltage interfaces and clock-domain management.
• Industrial Temperature Rating: Qualified for −40 °C to 85 °C operation, supporting deployment in a wide range of industrial environments.
• Compact, Surface-Mount Package: 256-LBGA (17×17 mm supplier package) minimizes PCB area while providing ample I/O connectivity.
• Vendor Ecosystem & Diagnostics: Family-level in-system diagnostic and debug capability (Microchip Silicon Explorer II) supports development and field diagnosis.

Why Choose AX250-FGG256I?

The AX250-FGG256I positions itself as a robust mid-density antifuse FPGA option for industrial designs that demand nonvolatile configuration, secure programming and predictable timing. With approximately 250,000 gates, 4,224 logic elements and on-chip RAM, the device balances logic capacity and embedded memory for control, interface and data-path tasks.

Engineers designing industrial automation, communications or instrumentation equipment gain a compact, RoHS-compliant solution with industrial temperature operation, flexible I/O, embedded FIFO support and integrated clocking — enabling simplified BOMs and reliable long-term deployments.

Request a quote or submit an RFQ to receive pricing and availability for AX250-FGG256I and to discuss how this Axcelerator FPGA can fit into your design.