AX250-FG484I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA |
|---|---|
| Quantity | 803 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-FG484I – Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA
The AX250-FG484I is an Axcelerator family FPGA built on Microchip's AX antifuse architecture. It delivers 250,000 equivalent system gates with 4,224 logic elements, 55,296 bits of embedded RAM/FIFO and up to 248 user I/Os in a 484-ball BGA footprint for industrial embedded applications.
Designed for high-performance, nonvolatile single-chip implementations, the device supports segmentable clocks, multiple PLLs, embedded SRAM with FIFO control logic and mixed-voltage I/O, making it suitable for demanding networking, communications and industrial control designs that require deterministic timing and on-chip memory resources.
Key Features
- Core Capacity — 250,000 equivalent system gates and 4,224 logic elements provide substantial logic resources for mid-density designs.
- Embedded Memory & FIFOs — Approximately 55 kb of embedded RAM/FIFO with variable-aspect RAM blocks and programmable embedded FIFO control logic for buffering and data-path implementations.
- I/O Flexibility — 248 user I/Os with bank-selectable operation and multi-standard support including single-ended and differential standards; LVDS-capable I/Os up to 700 Mb/s.
- Clocking & PLLs — Segmentable clock resources and multiple phase-locked loops for on-chip frequency synthesis and deterministic timing (PLLs support wide input ranges per family specification).
- Performance — Family-level performance characteristics include system performance in the 350+ MHz range and internal performance above 500 MHz, enabling high-speed implementations.
- Manufacturing & Process — CMOS antifuse process on 0.15 µm with seven metal layers for a single-chip, nonvolatile solution and footprint-compatible packaging.
- Package & Mounting — 484-ball fine-pitch BGA (484-FPBGA, 23×23) surface-mount package suitable for compact board designs.
- Power & Temperature — Core supply 1.425 V to 1.575 V; industrial operating temperature range −40 °C to +85 °C.
- Compliance — RoHS compliant.
Typical Applications
- High‑Performance Networking — Implement packet-processing engines, protocol bridges and LVDS interface logic where deterministic timing and on-chip FIFOs accelerate data flow.
- Telecommunications Equipment — Use for line cards, transceiver logic and timing-critical data-paths that benefit from embedded RAM and multiple PLLs.
- Industrial Control Systems — Deploy as the programmable control and I/O hub for machine control, motion interfaces and deterministic industrial protocols across an extended temperature range.
- Test & Measurement — Implement data capture, buffering and high-speed I/O handling using embedded FIFOs and LVDS-capable interfaces.
Unique Advantages
- Nonvolatile, Single‑Chip Solution: Antifuse-based architecture provides a one-time programmable, nonvolatile FPGA implementation that eliminates the need for external configuration memory.
- Deterministic Timing: Segmentable clocks and on-chip PLLs support precise, user-controllable timing for latency-sensitive designs.
- Embedded Memory with FIFO Control: On-chip RAM and programmable FIFO logic reduce external buffer requirements and simplify high-throughput data-paths.
- Flexible I/O Standards: Bank-selectable, multi-voltage I/Os and differential support (including LVDS) enable easy interfacing to a wide range of peripherals and signaling domains.
- Industrial Temperature Range: Specified operation from −40 °C to +85 °C supports deployment in industrial environments.
- Compact BGA Package: 484-ball FPBGA (23×23) minimizes board area while providing ample I/O count for complex designs.
Why Choose AX250-FG484I?
The AX250-FG484I positions itself as a mid-density, high-performance Axcelerator FPGA offering a balance of logic capacity, embedded memory and flexible I/O in a compact BGA package. Its nonvolatile antifuse architecture, segmentable clocks and PLL resources make it well suited for designers needing deterministic timing, on-chip buffering and reliable single-chip configuration.
Choose this device for industrial embedded systems, telecommunications and networking equipment, or any application that requires a programmable, nonvolatile FPGA with significant I/O capability, embedded RAM and extended temperature operation. The device’s family-level performance and feature set provide a scalable path within the Axcelerator lineup.
If you would like pricing, lead-time or availability information for AX250-FG484I, request a quote or submit an inquiry to receive a formal quotation and technical support options.

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