AX250-FG484I

IC FPGA 248 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

Quantity 803 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-FG484I – Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

The AX250-FG484I is an Axcelerator family FPGA built on Microchip's AX antifuse architecture. It delivers 250,000 equivalent system gates with 4,224 logic elements, 55,296 bits of embedded RAM/FIFO and up to 248 user I/Os in a 484-ball BGA footprint for industrial embedded applications.

Designed for high-performance, nonvolatile single-chip implementations, the device supports segmentable clocks, multiple PLLs, embedded SRAM with FIFO control logic and mixed-voltage I/O, making it suitable for demanding networking, communications and industrial control designs that require deterministic timing and on-chip memory resources.

Key Features

  • Core Capacity — 250,000 equivalent system gates and 4,224 logic elements provide substantial logic resources for mid-density designs.
  • Embedded Memory & FIFOs — Approximately 55 kb of embedded RAM/FIFO with variable-aspect RAM blocks and programmable embedded FIFO control logic for buffering and data-path implementations.
  • I/O Flexibility — 248 user I/Os with bank-selectable operation and multi-standard support including single-ended and differential standards; LVDS-capable I/Os up to 700 Mb/s.
  • Clocking & PLLs — Segmentable clock resources and multiple phase-locked loops for on-chip frequency synthesis and deterministic timing (PLLs support wide input ranges per family specification).
  • Performance — Family-level performance characteristics include system performance in the 350+ MHz range and internal performance above 500 MHz, enabling high-speed implementations.
  • Manufacturing & Process — CMOS antifuse process on 0.15 µm with seven metal layers for a single-chip, nonvolatile solution and footprint-compatible packaging.
  • Package & Mounting — 484-ball fine-pitch BGA (484-FPBGA, 23×23) surface-mount package suitable for compact board designs.
  • Power & Temperature — Core supply 1.425 V to 1.575 V; industrial operating temperature range −40 °C to +85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High‑Performance Networking — Implement packet-processing engines, protocol bridges and LVDS interface logic where deterministic timing and on-chip FIFOs accelerate data flow.
  • Telecommunications Equipment — Use for line cards, transceiver logic and timing-critical data-paths that benefit from embedded RAM and multiple PLLs.
  • Industrial Control Systems — Deploy as the programmable control and I/O hub for machine control, motion interfaces and deterministic industrial protocols across an extended temperature range.
  • Test & Measurement — Implement data capture, buffering and high-speed I/O handling using embedded FIFOs and LVDS-capable interfaces.

Unique Advantages

  • Nonvolatile, Single‑Chip Solution: Antifuse-based architecture provides a one-time programmable, nonvolatile FPGA implementation that eliminates the need for external configuration memory.
  • Deterministic Timing: Segmentable clocks and on-chip PLLs support precise, user-controllable timing for latency-sensitive designs.
  • Embedded Memory with FIFO Control: On-chip RAM and programmable FIFO logic reduce external buffer requirements and simplify high-throughput data-paths.
  • Flexible I/O Standards: Bank-selectable, multi-voltage I/Os and differential support (including LVDS) enable easy interfacing to a wide range of peripherals and signaling domains.
  • Industrial Temperature Range: Specified operation from −40 °C to +85 °C supports deployment in industrial environments.
  • Compact BGA Package: 484-ball FPBGA (23×23) minimizes board area while providing ample I/O count for complex designs.

Why Choose AX250-FG484I?

The AX250-FG484I positions itself as a mid-density, high-performance Axcelerator FPGA offering a balance of logic capacity, embedded memory and flexible I/O in a compact BGA package. Its nonvolatile antifuse architecture, segmentable clocks and PLL resources make it well suited for designers needing deterministic timing, on-chip buffering and reliable single-chip configuration.

Choose this device for industrial embedded systems, telecommunications and networking equipment, or any application that requires a programmable, nonvolatile FPGA with significant I/O capability, embedded RAM and extended temperature operation. The device’s family-level performance and feature set provide a scalable path within the Axcelerator lineup.

If you would like pricing, lead-time or availability information for AX250-FG484I, request a quote or submit an inquiry to receive a formal quotation and technical support options.

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