AX250-FG256M

The AX250-FG256M is a Microchip Axcelerator antifuse FPGA delivering 250,000 equivalent system gates in a 256-ball fine BGA package. Built on the Axcelerator (AX) architecture, it combines nonvolatile antifuse programming with embedded SRAM, PLLs and segmentable clocking for high-performance, secure implementations.

Targeted at applications that require military-grade temperature range and robust I/O flexibility, this device provides 4,224 logic elements, approximately 55.3 kbits of embedded RAM, and 138 user I/Os in a surface-mount 256-LBGA footprint. Core supply operates at 1.425 V to 1.575 V and the device is rated for −55 °C to 125 °C.

Key Features

• Core Capacity — 250,000 equivalent system gates with 4,224 logic elements, enabling medium-density custom logic integration.
• Embedded Memory — 55,296 total RAM bits (approximately 55.3 kbits) with support for embedded FIFO control logic for buffering and data flow management.
• I/O Flexibility — 138 user I/Os with multi-standard, bank-selectable I/O support (family-level support for 1.5 V, 1.8 V, 2.5 V and 3.3 V standards, and differential interfaces such as LVDS and LVPECL as documented in the Axcelerator family specifications).
• High-Speed Performance — Axcelerator family benefits include 350+ MHz system performance and 500+ MHz internal performance capability, plus up to 700 Mb/s LVDS-capable I/Os (family-level characteristics).
• Programmable Clocking and PLL — Segmentable clock resources and embedded PLLs (family-level features) support flexible clocking and frequency synthesis.
• Nonvolatile Antifuse Technology — Single-chip, nonvolatile programming with FuseLock™ protection to reduce risk of reverse engineering and secure designs (family-level feature).
• Package and Mounting — 256-LBGA (supplier device package: 256-FPBGA, 17 × 17 mm) surface-mount package suitable for compact board designs.
• Military Grade — Grade: Military with operating temperature range from −55 °C to 125 °C for demanding environments.
• Power — Core voltage supply requirement: 1.425 V to 1.575 V for low-voltage operation.
• Compliance — RoHS compliant.

Typical Applications

• Military & Defense Systems — Suitable for mission-critical designs that require military-grade temperature operation and secure, nonvolatile FPGA programming.
• High-Speed Data Interfaces — Use where LVDS-capable I/Os and high internal performance are needed for protocol bridging, SERDES pre- or post-processing, and high-throughput signaling (per family-level I/O capability).
• Embedded Signal Processing — Implements custom, medium-density signal-processing pipelines using 4,224 logic elements and embedded SRAM/FIFO resources for temporary data storage.
• Communications Infrastructure — Ideal for line cards, protocol converters, and interface modules that require deterministic timing and flexible I/O standards.

Unique Advantages

• Nonvolatile, Secure Programming: Antifuse programming and FuseLock™ technology provide one-time programmable, tamper-resistant configurations for secure IP protection.
• Deterministic Timing Controls: Segmentable clocks and family-level deterministic timing features simplify timing closure for complex designs.
• Compact, Rugged Packaging: 256-LBGA (17 × 17 mm FPBGA) surface-mount package balances board area and I/O availability for space-constrained systems.
• High-Temperature Operation: Military-grade −55 °C to 125 °C rating enables deployment in harsh thermal environments.
• Low-Voltage Core: 1.425 V–1.575 V core supply supports low-power design strategies while maintaining performance.
• Embedded FIFO and SRAM Support: On-chip RAM and FIFO control logic facilitate efficient buffering and data management without external memory.

Why Choose AX250-FG256M?

The AX250-FG256M delivers a balanced combination of mid-range logic capacity, flexible I/O, secure antifuse nonvolatile programming and military-grade environmental tolerance. It is suited for designers needing a robust, reprogrammable (one-time programmable) FPGA platform with embedded memory and clocking resources for deterministic, high-performance applications.

This device is a practical choice for engineers building secure communications, defense, or high-speed signal-processing systems requiring reliable operation across extreme temperatures and a compact BGA footprint. The Axcelerator family’s documented features—embedded PLLs, segmentable clocks, and embedded FIFO logic—support scalable designs and integration into existing system architectures.

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