AX250-FG256

IC FPGA 138 I/O 256FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA

Quantity 280 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O138Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-FG256 – Axcelerator FPGA, 138 I/Os, ~55 kbits Embedded RAM, 256-LBGA

The AX250-FG256 is an Axcelerator family Field Programmable Gate Array (FPGA) IC offering 250,000 equivalent system gates implemented in Microchip's AX antifuse architecture. Built for single-chip, nonvolatile programmable logic, the device delivers high internal performance, flexible multi-standard I/Os and on-chip embedded SRAM/FIFO capability for designs that require deterministic timing and design security.

Key value propositions include high system and internal performance, integrated memory and FIFO support, and a wide set of programmable I/O standards — all in a 256-ball BGA package targeted at commercial-temperature applications.

Key Features

  • Core Performance AX architecture antifuse FPGA with 250,000 equivalent system gates and up to 500+ MHz internal performance and 350+ MHz system performance as documented for the Axcelerator family.
  • Logic Capacity 4,224 logic elements (cells) enabling medium-density programmable logic implementations.
  • Embedded Memory & FIFO Approximately 55 kbits (55,296 bits) of on-chip RAM with embedded FIFO control logic and variable-aspect 4,608-bit RAM blocks supporting multiple organizations and independent width-configurable ports.
  • I/O Flexibility 138 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and multiple single-ended and differential standards (LVTTL/LVCMOS/PCI, LVPECL, LVDS), plus bank-selectable I/Os and programmable drive/slew controls.
  • Clocking & PLLs Segmentable clock resources and embedded PLL(s) supporting 14–200 MHz input range with frequency synthesis capability up to 1 GHz as part of the Axcelerator device family.
  • Security & Programming Single-chip, nonvolatile antifuse implementation with FuseLock programming technology to protect against reverse engineering and design theft.
  • Power & Voltage Core supply voltage specified from 1.425 V to 1.575 V to support low-power 1.5V core operation.
  • Package & Mounting 256-ball LBGA / 256-FPBGA (17×17) package, surface-mount mounting type suitable for compact board designs.
  • Commercial Temperature Grade Rated for operation from 0 °C to 70 °C and supplied in RoHS-compliant packaging.

Typical Applications

  • High-performance system logic — Implement medium-density custom logic, protocol bridging, and control functions that require deterministic timing and high internal performance.
  • Embedded memory and FIFO buffering — Use the integrated SRAM/FIFO blocks for data buffering, interface bridging and packet handling in communication subsystems.
  • Multi-standard I/O interfacing — Leverage bank-selectable, mixed-voltage I/Os and differential standards for flexible connectivity between legacy and modern interfaces.

Unique Advantages

  • Single-chip nonvolatile solution: Antifuse architecture provides a one-time programmable, nonvolatile configuration that simplifies system boot and eliminates external configuration flash.
  • Deterministic, high-speed timing: Segmentable clocks and embedded PLLs enable controlled, high-performance timing suitable for demanding logic and interface designs.
  • Integrated embedded RAM/FIFO: On-chip memory with programmable FIFO control reduces external memory requirements and simplifies board-level design for data buffering tasks.
  • Flexible, programmable I/Os: Support for multiple voltage domains and I/O standards reduces BOM and enables interface consolidation across banks.
  • Design security: FuseLock programming technology helps protect intellectual property against reverse engineering.
  • Compact packaging: 256-ball BGA (17×17 FPBGA) enables dense board layouts while providing ample I/O count.

Why Choose AX250-FG256?

The AX250-FG256 combines a mid-range logic capacity with high internal and system performance characteristic of the Axcelerator antifuse family. Its integrated SRAM/FIFO blocks, flexible multi-standard I/Os and on-chip PLLs make it well suited for commercial-temperature designs that need deterministic timing, secure nonvolatile configuration and compact packaging.

This device is appropriate for engineering teams building medium-density programmable logic solutions where integration, timing control and I/O flexibility reduce overall system complexity and board-level component count.

Request a quote or submit a sales inquiry to get pricing, lead-time and availability details for the AX250-FG256.

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