AX250-2FGG484

IC FPGA 248 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

Quantity 728 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-2FGG484 – Axcelerator FPGA, 248 I/O, 484-BGA

The AX250-2FGG484 is an Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX architecture and CMOS antifuse process. It delivers a nonvolatile, single-chip FPGA solution with 250,000 equivalent system gates and 4,224 logic elements, targeting commercial applications that require high I/O density, embedded memory, and deterministic timing.

Configured in a 484-ball fine-pitch BGA (484-FPBGA, 23×23) surface-mount package, the device provides 248 user I/Os, on-chip embedded SRAM/FIFO (55,296 bits), segmentable clock resources and embedded PLLs, and operates from a 1.425 V to 1.575 V core supply at commercial temperature range (0 °C to 70 °C). The device is RoHS compliant.

Key Features

  • Core & Architecture  AX architecture with a nonvolatile CMOS antifuse implementation delivering 250,000 equivalent gates and 4,224 logic elements for system-level integration.
  • Memory & FIFO  Approximately 55,296 bits of embedded SRAM organized in core RAM blocks with programmable FIFO control logic to support buffering and width-configurable ports.
  • I/O Flexibility  248 user I/Os with bank-selectable configurations (up to 8 I/O banks), programmable slew rate and drive strength, and support for multiple single-ended and differential standards including LVDS capable to 700 Mb/s.
  • Clocking & Timing  Segmentable clock resources and embedded phase-locked loops (PLLs) with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for precision clocking and timing control.
  • Performance  System-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance for demanding timing requirements.
  • Security & Nonvolatile Programming  Antifuse-based nonvolatile programming with FuseLock programming technology to protect IP from reverse engineering and support deterministic, user-controllable timing.
  • Package & Power  484-ball FPBGA package (23×23) for surface-mount assembly; nominal core supply 1.5 V (specified 1.425 V to 1.575 V); commercial grade operation from 0 °C to 70 °C.
  • Diagnostics & Test  In-system diagnostic and debug capability via Microchip Silicon Explorer II and boundary-scan testing compliant with IEEE 1149.1 (JTAG).
  • Compliance  RoHS-compliant lead-free packaging.

Typical Applications

  • High-speed data buffering and protocol bridging  Embedded FIFO control logic and on-chip SRAM make the device suitable for buffering, protocol conversion and packet handling at high data rates.
  • Communications and networking interfaces  LVDS-capable I/Os and high internal/system performance allow implementation of serializer/deserializer logic, interface bridges and PHY control in commercial communications equipment.
  • System glue logic and custom control  Dense I/O, deterministic timing and flexible I/O standards enable consolidation of glue logic, bus arbitration and custom state machines in compact designs.
  • Test and measurement equipment  High internal performance, embedded memory and precise clocking support real-time data capture, preprocessing and deterministic control in lab instrumentation and test fixtures.

Unique Advantages

  • Nonvolatile single-chip solution: Eliminates external configuration memory and supports secured, permanent programming using antifuse technology.
  • High I/O density: 248 user I/Os and bank-selectable I/O organization reduce the need for external glue logic and simplify board-level routing.
  • Deterministic timing and clock synthesis: Segmentable clocks plus embedded PLLs provide precise timing control and frequency synthesis up to 1 GHz for complex timing domains.
  • Integrated memory and FIFO support: Approximately 55,296 bits of embedded SRAM with programmable FIFO control simplifies data buffering and stream handling on-chip.
  • Security-focused programming: FuseLock programming technology protects design IP from reverse engineering and supports secure deployments.
  • Commercial readiness: Surface-mount 484-FPBGA package, RoHS compliance and standard supply-voltage range make the device suitable for commercial electronics production.

Why Choose AX250-2FGG484?

The AX250-2FGG484 combines AX-architecture antifuse technology with a dense logic fabric, substantial on-chip memory and high I/O count to deliver a compact, nonvolatile FPGA solution for commercial systems. With deterministic timing resources, embedded PLLs and high-performance internal operation, it is well suited to designs that require secure, permanent configuration and robust clocking for high-throughput data handling.

This device is aimed at engineers building commercial communications, test and instrumentation, and system integration solutions who need a reliable, high-I/O FPGA with integrated memory and security features, packaged for surface-mount assembly and compliant with RoHS requirements.

Request a quote or submit a quote request to initiate procurement and evaluate AX250-2FGG484 for your next commercial FPGA design.

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