AX250-2FG484

IC FPGA 248 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

Quantity 125 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-2FG484 – Axcelerator FPGA, 250k gates, 248 I/Os, 484-BGA

The AX250-2FG484 is an Axcelerator family Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX architecture and antifuse CMOS process. This commercial-grade, single-chip nonvolatile solution delivers 250,000 equivalent system gates, 4,224 logic elements and 55,296 bits of embedded SRAM/FIFO, targeted at high-performance embedded and communications designs that require deterministic timing, on-chip memory and flexible I/O.

Designed for surface-mount applications, the device is supplied in a 484-ball FPBGA (23×23) package and operates from a core supply range of 1.425 V to 1.575 V with an operating temperature range of 0 °C to 70 °C. It is RoHS compliant and includes family-level features such as segmentable clocks, PLLs and security-oriented programming.

Key Features

  • Core Capacity and Logic — 250,000 equivalent system gates with 4,224 logic elements for implementing mid-range to complex logic functions.
  • Embedded Memory & FIFOs — 55,296 bits of embedded SRAM/FIFO and high-performance embedded FIFO control logic for buffering and streaming data on-chip.
  • I/O Density and Standards — 248 user I/Os with multi-standard support in the Axcelerator family, including LVDS-capable channels (700 Mb/s mentioned at the family level) and bank-selectable mixed-voltage operation.
  • Performance — Family-level performance indicators include 350+ MHz system performance and 500+ MHz internal performance, enabling high-speed datapaths and logic operation.
  • Clocking and PLL — Segmentable clock resources and embedded PLLs with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz (family-level specification).
  • Nonvolatile Antifuse Technology & Security — Single-chip, nonvolatile antifuse programming and FuseLock™ programming technology to protect against reverse engineering and design theft (family-level features).
  • Power — Core supply range centered around 1.5 V (1.425 V to 1.575 V) to support low-power core operation.
  • Package & Mounting — Surface-mount 484-BGA package (484-FPBGA, 23×23 footprint) suitable for compact board-level integration.
  • Compliance & Testing — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and RoHS-compliant manufacturing.

Typical Applications

  • High-speed Communications — Use the device's high I/O count and LVDS-capable interfaces for serializers, protocol bridges and line-rate packet processing.
  • Embedded Signal Processing — Implement DSP pipelines and hardware-accelerated processing using the device's 250k-gate capacity, internal RAM and high internal performance.
  • System Control and Timing — Leverage segmentable clocks, deterministic timing and on-chip PLLs for precision timing, synchronization and control logic in embedded systems.
  • Custom Hardware Acceleration — Create application-specific accelerators (offload engines, protocol handlers) using the combination of logic elements and embedded FIFOs to improve throughput and latency.

Unique Advantages

  • Single-chip Nonvolatile Solution: Antifuse-based programming provides nonvolatile on-chip configuration, eliminating the need for external configuration memory.
  • Deterministic, High-performance Timing: Segmentable clocks and embedded PLLs support stable, user-controllable timing suitable for high-speed datapaths.
  • Flexible I/O and Mixed-Voltage Support: Bank-selectable I/Os and multiple supported standards enable integration with a wide range of interfaces and voltage domains.
  • Embedded FIFO and Memory Resources: On-chip SRAM blocks and programmable FIFO control simplify buffering and dataflow management without external RAM.
  • Security and IP Protection: FuseLock™ programming technology and nonvolatile antifuse architecture reduce the risk of reverse engineering and protect design IP.
  • Proven Ecosystem Support: Family-level in-system diagnostic and debug capability with Microchip Silicon Explorer II provides development and test support.

Why Choose AX250-2FG484?

The AX250-2FG484 combines mid-range logic capacity, substantial on-chip memory and a high I/O count in a compact 484-BGA package, making it well suited for commercial embedded designs that demand deterministic timing, on-chip buffering and security. As part of Microchip's Axcelerator antifuse family, it benefits from family-level capabilities such as segmentable clocks, embedded PLLs and FuseLock programming for IP protection.

Choose the AX250-2FG484 when you need a surface-mount, nonvolatile FPGA solution with 250k equivalent gates, 4,224 logic elements and 55,296 bits of embedded memory for high-performance communication, processing and control applications in commercial temperature environments.

Request a quote or submit an RFQ for AX250-2FG484 to receive pricing, availability and ordering information.

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