AX250-2FGG256
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA |
|---|---|
| Quantity | 206 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 138 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-2FGG256 – Axcelerator FPGA IC, 250k Gates, 256-LBGA
The AX250-2FGG256 is an Axcelerator family antifuse FPGA implementing Microchip’s AX architecture as a single-chip, nonvolatile solution. It delivers 250,000 equivalent system gates with 4,224 logic elements, 138 user I/Os and approximately 55,296 bits of on-chip RAM (55,296 total RAM bits reported in the family profile; this device lists 55,296/55,296 as total RAM bits in the family table).
Designed for applications that demand deterministic timing, embedded FIFO capability and multi-standard I/O flexibility, the device combines on-chip SRAM/FIFO control, segmentable clocks and integrated PLLs to support high-performance data-path and control logic in a surface-mount 256-LBGA package.
Key Features
- Core & Architecture AX architecture based on antifuse technology providing a single-chip, nonvolatile FPGA implementation and deterministic, user-controllable timing.
- Logic Capacity 250,000 equivalent system gates and 4,224 logic elements (cells) for medium-density logic integration.
- Embedded Memory Total on-chip RAM bits reported as 55,296 in the Axcelerator family profile; memory blocks include variable-aspect 4,608-bit RAM blocks with embedded FIFO control logic.
- I/O Flexibility 138 user I/Os with support for mixed voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and differential standards including LVDS; I/Os are bank-selectable and support programmable slew and drive strength.
- High-Speed Performance Family-level performance figures include 350+ MHz system performance and 500+ MHz internal performance; I/Os capable of 700 Mb/s LVDS signaling.
- Clocking & PLL Segmentable clock resources and embedded PLLs with frequency synthesis capabilities to support a wide range of system clocking needs.
- Security & Programming FuseLock™ programming technology for design protection, plus boundary-scan (JTAG) support for testing and in-system diagnostics.
- Package & Mounting Surface-mount 256-LBGA (supplier package: 256-FPBGA, 17×17) for compact board-level integration.
- Power & Operating Range Core supply range 1.425 V to 1.575 V (nominal 1.5 V) and commercial operating temperature 0 °C to 70 °C.
- Compliance RoHS-compliant.
Typical Applications
- High-speed data buffering and interface bridging — Embedded SRAM and FIFO control logic with LVDS-capable I/Os enable on-chip buffering and protocol bridging for high-bandwidth links.
- Deterministic control and timing — Segmentable clocks and user-controllable timing make the device suitable for systems that require predictable, repeatable timing.
- Protocol conversion and glue logic — Mixed-voltage, bank-selectable I/Os and programmable drive/slew settings simplify interfacing between different I/O standards on a single board.
- Compact system integration — The 256-LBGA surface-mount package allows medium-density logic and memory to be integrated into space-constrained designs.
Unique Advantages
- Single-chip nonvolatile solution: Eliminates the need for external configuration memory and simplifies power-up behavior for production systems.
- Embedded FIFO and SRAM control: Reduces BOM by providing configurable on-chip buffering and memory management for streaming or packetized data.
- Flexible, multi-standard I/Os: Bank-selectable I/Os and support for single-ended and differential standards enable easy interfacing to legacy and modern peripherals.
- Deterministic performance: User-controllable timing and segmentable clock resources provide predictable timing behavior for real-time and synchronous systems.
- Compact package with surface-mount mounting: 256-LBGA (256-FPBGA, 17×17) offers a balance of pin count and board area for medium-density FPGA integration.
Why Choose AX250-2FGG256?
The AX250-2FGG256 positions itself as a medium-density Axcelerator FPGA that combines nonvolatile antifuse programming, substantial logic capacity and embedded memory/FIFO control in a compact 256-LBGA package. Its AX architecture and family-level capabilities—segmentable clocks, PLLs and multi-standard I/Os—make it suitable for systems that need deterministic timing, high-speed I/O and on-chip buffering without external configuration components.
This device is well suited for design teams seeking a robust, integrated FPGA platform for medium-complexity data-path, interface and control applications where predictable timing, reduced BOM and RoHS compliance are important considerations.
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