AX250-2FG256I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA |
|---|---|
| Quantity | 1,109 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 138 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-2FG256I – Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA
The AX250-2FG256I is an Axcelerator antifuse FPGA from Microchip Technology built on the AX architecture. This surface-mount, industrial-grade device provides 250,000 equivalent system gates with 4,224 logic elements and approximately 55 kbits of embedded memory, making it suitable for demanding industrial and embedded system designs that require nonvolatile, high-performance programmable logic.
As part of the Axcelerator family, the device offers high-speed internal and system performance characteristics and flexible I/O support, enabling implementation of complex control, data-path and interface functions within a single nonvolatile FPGA package.
Key Features
- Core Capacity 250,000 equivalent system gates and 4,224 logic elements provide a compact programmable fabric for mid‑density logic implementations.
- Embedded Memory 55,296 total RAM bits (approximately 55 kbits) with embedded FIFO control logic for buffering and data-path applications.
- I/O Flexibility 138 user I/Os with support for mixed-voltage operation and high-speed differential interfaces; LVDS-capable channels up to 700 Mb/s as provided by the Axcelerator family.
- High-Speed Clocking and PLLs Embedded phase-locked loop (PLLs) with a 14–200 MHz input range and frequency synthesis capability up to 1 GHz (Axcelerator family specification) to support high-performance timing requirements.
- Performance Family-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance as specified for Axcelerator devices.
- Power Core supply range of 1.425 V to 1.575 V (1.5 V nominal) for low-voltage core operation.
- Package and Mounting 256-ball LBGA surface-mount package (supplier package: 256-FPBGA, 17 × 17 mm) for high-density board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 85 °C to meet industrial environmental requirements.
- Security and Test FuseLock programming technology for design protection and IEEE 1149.1 (JTAG) boundary-scan support for board-level testing; unique in‑system diagnostic and debug capability with Microchip Silicon Explorer II.
- Standards and Configurability Bank-selectable I/Os and support for multiple single-ended and differential I/O standards across mixed-voltage banks (Axcelerator family capability).
Typical Applications
- Industrial Control Implement motor control, PLC logic, and deterministic control functions using the device’s industrial temperature rating, deterministic timing, and embedded memory resources.
- High‑Speed Communications Use LVDS-capable I/Os and embedded FIFOs to handle high-speed serial interfaces and data buffering in communication modules and backplane interfaces.
- Embedded Systems Integrate custom datapaths, protocol handling, and interface bridging where nonvolatile configuration and mid-density logic capacity are required.
- Test & Measurement Take advantage of boundary-scan (JTAG) and in-system diagnostics for instrument control, data acquisition front-ends, and automated test applications.
Unique Advantages
- Nonvolatile, single‑chip solution: Eliminates the need for separate configuration memory by using antifuse technology for permanent on-chip configuration.
- High-speed timing resources: On-chip PLLs and segmentable clock resources enable deterministic, high-performance designs with flexible clocking options.
- Flexible mixed-voltage I/O: Bank-selectable I/O standards and programmable drive/slew options simplify interfacing with a wide range of external devices.
- Security by design: FuseLock programming technology protects designs against reverse engineering and unauthorized duplication.
- Debug and test support: Built-in IEEE 1149.1 boundary-scan and Microchip Silicon Explorer II support streamline in-system debug and manufacturing test.
- Industrial-rated robustness: Specified for −40 °C to 85 °C operation and RoHS-compliant construction for deployment in industrial applications.
Why Choose AX250-2FG256I?
The AX250-2FG256I delivers a balanced combination of mid-range logic capacity, embedded memory, and high-speed I/O capabilities within a nonvolatile antifuse FPGA architecture. Its 1.5 V core, integrated PLLs, embedded FIFOs and security features make it well suited for industrial and embedded designs that require reliable, permanent configuration and deterministic performance.
Manufactured by Microchip Technology and offered in a compact 256-LBGA package, this device is a practical choice for engineers seeking a robust programmable solution that integrates logic, memory and high-speed interfaces while supporting industrial temperature requirements and production testing workflows.
Request a quote or submit a sales inquiry to obtain pricing and availability for the AX250-2FG256I and to discuss how it can fit your next design.

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