AX250-2FGG256I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA |
|---|---|
| Quantity | 756 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 138 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-2FGG256I – Axcelerator Field Programmable Gate Array (FPGA) IC 138 I/Os · 55,296 bits · 256-LBGA
The AX250-2FGG256I is an Axcelerator family FPGA from Microchip Technology, offering a nonvolatile, antifuse-based programmable logic solution with approximately 250,000 equivalent system gates. It combines high-performance logic, embedded memory and flexible I/O to support systems that require deterministic timing, embedded FIFO buffering and multi-standard interface capability.
With 4,224 logic elements, about 55.3 kbits of embedded RAM, 138 user I/Os and on-chip PLL resources, this device targets applications needing high internal throughput, secure programming and industrial temperature operation.
Key Features
- Core Capacity — Approximately 250,000 equivalent system gates realized across 4,224 logic elements for mid-density programmable logic.
- Embedded Memory & FIFOs — Total on-chip RAM of 55,296 bits with embedded FIFO control logic and variable-aspect RAM blocks for flexible buffering and data-path width configurations.
- I/O Flexibility — 138 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V and 3.3V) and high-speed differential capability (LVDS, 700 Mb/s capable).
- High-Speed Timing — Device family-level performance includes 350+ MHz system performance and 500+ MHz internal performance; on-chip PLLs provide frequency synthesis and clock management (14–200 MHz input range, synthesis up to 1 GHz).
- Secure, One-Time Programmable Technology — Antifuse-based, single-chip nonvolatile solution with FuseLock programming technology to protect against reverse engineering and unauthorized readback.
- Deterministic Design & Debug — Deterministic, user-controllable timing, boundary-scan testing (IEEE 1149.1/JTAG) and in-system diagnostic/debug capability via Microchip Silicon Explorer II.
- Power & Package — Core voltage supply range of 1.425 V to 1.575 V, surface-mount 256-LBGA package (supplier package 256-FPBGA, 17×17 mm footprint), and RoHS-compliant construction.
- Industrial Temperature — Rated for operation from −40 °C to +85 °C for industrial application environments.
Typical Applications
- High-speed serial interfaces — LVDS-capable I/Os and on-chip PLLs enable implementation of differential serial links and protocol bridging where multi-gigabit-equivalent timing synthesis is required.
- Embedded buffering and packet processing — Built-in FIFO control logic and 55,296 bits of embedded RAM simplify packet buffering, width conversion and real-time data staging.
- Custom logic and ASIC replacement — Mid-density logic (≈250k gates) and flexible I/O standards support migration of custom glue logic and application-specific functions into a single nonvolatile device.
- Industrial control and communications — Industrial temperature rating, mixed-voltage I/O and deterministic timing make the device suitable for control, protocol conversion and communications front-ends in industrial systems.
Unique Advantages
- Single-chip nonvolatile solution: Antifuse architecture provides one-time programmable, nonvolatile implementation—no external configuration memory required.
- Secure programmability: FuseLock protection reduces risk of reverse engineering and IP exposure for deployed designs.
- Flexible I/O standards: Bank-selectable, multi-voltage I/Os and supported differential standards enable broad interface compatibility without external level shifters.
- On-chip timing synthesis: Embedded PLLs and segmentable clock resources deliver frequency synthesis and deterministic, user-controllable timing for high-performance systems.
- Integrated debugging and test: In-system diagnostics with Silicon Explorer II and IEEE 1149.1 boundary-scan support simplify development and manufacturing test flows.
- Industrial-grade thermal range and RoHS compliance: Rated −40 °C to +85 °C and RoHS-compliant for deployment in industrial environments.
Why Choose AX250-2FGG256I?
The AX250-2FGG256I delivers a balanced mix of mid-level logic capacity, embedded memory and versatile I/O in a single-chip, nonvolatile FPGA from Microchip Technology. Its antifuse-based architecture and FuseLock protection provide a secure, one-time programmable alternative for designs that require deterministic timing, embedded FIFO support and flexible interface standards.
This device is well-suited for engineers building industrial communications, custom logic consolidation or high-speed data-path designs who need predictable timing behavior, on-chip buffering and integrated PLL-based clocking—all in a 256-LBGA surface-mount package rated for industrial temperatures.
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