AX250-FGG484
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA |
|---|---|
| Quantity | 809 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-FGG484 – Axcelerator Field Programmable Gate Array (FPGA) IC, 248 I/Os, ~55 kbits RAM, 484-BGA
The AX250-FGG484 is a commercial-grade Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture. It delivers a nonvolatile, single-chip FPGA solution with high-performance routing, segmentable clocks and embedded memory and FIFO control logic suitable for demanding logic and data-path applications.
This device targets applications that require high internal performance, flexible multi-standard I/Os and hardened security: it combines 250,000 gates, 4,224 logic elements and approximately 55 kbits of embedded memory in a 484-ball BGA package.
Key Features
- Core Architecture Antifuse-based Axcelerator architecture providing a nonvolatile single-chip FPGA implementation with deterministic, user-controllable timing.
- Logic Resources 4,224 logic elements (cells) and 250,000 gates to implement complex combinatorial and sequential logic functions.
- Embedded Memory & FIFOs Approximately 55 kbits of embedded SRAM with programmable FIFO control logic and independent, width-configurable read/write ports.
- I/O Flexibility 248 user I/Os with support for mixed-voltage operation and multi-standard interfaces, including LVDS-capable channels and single-ended standards such as LVTTL/LVCMOS and 3.3V PCI/PCI-X.
- Performance Architectural capabilities include segmentable clocks and embedded PLLs; the Axcelerator family supports high internal and system-level performance characteristics.
- Voltage & Power Core supply: 1.425 V to 1.575 V, optimized for low-voltage operation.
- Package 484-FPBGA (23 × 23 mm) ball-grid array package for surface-mount assembly.
- Operating Range Commercial-grade device specified for 0 °C to +70 °C.
- Security & Test FuseLock programming technology and support for boundary-scan (IEEE 1149.1 JTAG); in-system diagnostic and debug capability with Microchip Silicon Explorer II (per datasheet).
- Standards & I/O Controls Programmable slew rate and drive strength, programmable input delay and weak pull-up/pull-down options; bank-selectable I/Os (8 banks per chip).
Typical Applications
- Telecommunications & Networking High-speed packet processing, protocol bridging and line-card functions that benefit from embedded FIFOs, PLLs and LVDS-capable I/Os.
- Data Acquisition & Test Equipment Front-end logic, buffering and interface conversion where deterministic timing and on-chip FIFOs simplify board-level design.
- High-Speed Interface Conversion Designs requiring mixed-voltage I/O standards, LVDS channels and programmable I/O drive/slew control for reliable signal conditioning.
- Security-Sensitive Systems Applications that require nonvolatile antifuse programming and FuseLock protection to reduce risk of reverse engineering and protect intellectual property.
Unique Advantages
- Nonvolatile, single-chip solution: Eliminates configuration memory and boot-time reconfiguration, simplifying system start-up and ensuring retained programming.
- Flexible I/O and mixed-voltage support: Bank-selectable I/Os and multiple supported standards reduce the need for external level shifters and simplify multi-voltage designs.
- Embedded FIFOs and SRAM: On-chip RAM and FIFO control reduce external memory dependencies and improve data-path efficiency for streaming or burst transfers.
- Deterministic timing and PLL support: Segmentable clocks and embedded PLLs enable stable, user-controllable clocking for timing-critical applications.
- Security and testability: FuseLock programming and IEEE 1149.1 boundary-scan support help protect design IP and ease board-level debug and manufacturing test.
Why Choose AX250-FGG484?
The AX250-FGG484 combines the Axcelerator antifuse architecture with a practical balance of logic capacity, embedded memory and high-density I/O in a 484-ball BGA package. Its nonvolatile configuration, programmable I/Os and on-chip FIFOs make it well suited to designs that require compact, deterministic FPGA solutions with security-minded programming.
This device is ideal for teams building telecom, test equipment, high-speed interface or security-sensitive logic where persistent configuration, robust I/O options and embedded memory simplify the board-level BOM and improve system reliability over purely volatile FPGA alternatives.
Request a quote or submit a purchase inquiry to receive pricing and lead-time information for the AX250-FGG484.

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