EP1C12Q240C7N

The EP1C12Q240C7N is an Intel Cyclone® field programmable gate array (FPGA) built on a 1.5‑V, 0.13‑µm, all‑layer copper SRAM process. It provides a mid‑density FPGA fabric with 12,060 logic elements and approximately 0.24 Mbits of embedded RAM suitable for data‑path and control applications.

Targeted at commercial temperature designs, this surface‑mount device combines on‑chip memory, flexible I/O and integrated clocking resources to support custom logic, protocol bridging, and system interfacing in volume and prototype applications.

Key Features

• Logic Fabric — 12,060 logic elements to implement mid‑range combinational and sequential logic functions for data processing and control tasks.
• Embedded Memory — 239,616 total RAM bits (approximately 0.24 Mbits) for FIFOs, buffering and small on‑chip data storage.
• I/O Capacity — 173 user I/O pins provided in the 240‑pin package to handle multiple peripherals and external interfaces.
• Clocking — Cyclone family architecture includes up to two PLLs for clock multiplication and phase shifting to support diverse timing domains.
• Power — Core voltage supply range of 1.425 V to 1.575 V matching the device’s 1.5‑V process requirements.
• Package & Mounting — 240‑pin BFQFP package in a surface‑mount form factor (supplier listing: 240‑PQFP, 32×32) for straightforward PCB assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for general commercial and enterprise electronics.
• Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• Data‑path processing — Implement custom packet processing, parallel data manipulation, and protocol handling using the device’s logic density and embedded RAM.
• Memory interface and buffering — Use embedded RAM and clocking resources for buffering and timing adaptation between disparate system memories and peripherals.
• Custom peripheral control — Aggregate and manage multiple external I/O signals for sensors, actuators, or custom interfaces in consumer and industrial products.
• Prototyping and product migration — Leverage Cyclone family compatibility for design migration across densities within the same package footprint and I/O layout considerations.

Unique Advantages

• Mid‑density integration: 12,060 logic elements and ~0.24 Mbits of RAM deliver a balance of capacity and cost for many control and data applications.
• Flexible I/O count: 173 I/O pins in a 240‑pin package enable multiple peripheral connections without large BGA footprints.
• Built‑in clocking: Two PLLs provide on‑chip clock multiplication and phase control to simplify multi‑clock designs.
• Surface‑mount package: 240‑pin BFQFP (supplier 240‑PQFP, 32×32) supports standard SMT assembly processes for production builds.
• Commercial suitability and compliance: Commercial temperature rating and RoHS compliance fit mainstream electronics and supply chain requirements.

Why Choose EP1C12Q240C7N?

The EP1C12Q240C7N offers a practical combination of logic capacity, embedded memory and I/O density in a conventional 240‑pin surface‑mount package, making it well suited for designers who need a mid‑range Cyclone FPGA for data‑path, interface, and control applications. Its 1.5‑V SRAM process, integrated clocking resources and RoHS compliance deliver a predictable platform for production and prototyping across commercial‑temperature systems.

Choose this device when you need a scalable Cyclone family solution that balances integration and board‑level simplicity while supporting migration within the Cyclone lineup and typical commercial product requirements.

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