EP1C12Q240C7

IC FPGA 173 I/O 240QFP
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 173 239616 12060 240-BFQFP

Quantity 388 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O173Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12Q240C7 – Cyclone® Field Programmable Gate Array (FPGA) IC 173 239616 12060 240-BFQFP

The EP1C12Q240C7 is a Cyclone® family FPGA offering a balanced combination of logic capacity, embedded memory, and I/O for cost-sensitive data‑path and embedded designs. Based on the Cyclone 1.5‑V, 0.13‑µm all‑layer copper SRAM process, this device provides reprogrammable logic with on‑chip memory and a flexible I/O complement suited to commercial‑grade applications.

With 12,060 logic elements, approximately 0.24 Mbits of embedded RAM, and 173 user I/O, the EP1C12Q240C7 targets system designers who need mid‑density programmable logic in a 240‑pin QFP package with surface‑mount mounting and RoHS compliance.

Key Features

  • Logic Capacity  12,060 logic elements (LEs) provide the programmable fabric for implementing control, glue logic, and data‑path functions.
  • Embedded Memory  Approximately 0.24 Mbits of on‑chip RAM for FIFOs, buffers, and small data structures within logic designs.
  • I/O Resources  173 user I/O pins support a wide variety of external interfaces and peripheral connectivity.
  • Voltage and Process  Designed on a 1.5‑V Cyclone process; this part’s required core supply range is 1.425 V to 1.575 V.
  • Package and Mounting  Available in a 240‑BFQFP package (supplier package: 240‑PQFP 32×32) and intended for surface‑mount assembly.
  • Operating Range  Commercial temperature range, 0 °C to 85 °C, suited for standard electronics environments.
  • Family Features  Cyclone family capabilities include support for common I/O standards, up to two PLLs for clock management, and interfaces for external memory and high‑speed differential I/O (as defined by the Cyclone device family).
  • Compliance  RoHS compliant for lead‑free manufacturing processes.

Typical Applications

  • Embedded Control and Glue Logic  Implement custom control sequencing, protocol bridging, and peripheral aggregation where mid‑density programmable logic reduces BOM and accelerates development.
  • Memory Interface and Buffers  Use the on‑chip RAM and available clocking resources to build FIFOs, small buffering blocks, and SDRAM or DDR interface logic in system designs.
  • High‑Speed I/O and Data‑Path Processing  Deploy the device where multiple parallel or serialized interfaces and moderate I/O counts are required for data acquisition or communications front‑ends.
  • Prototyping and Product Migration  Mid‑density Cyclone logic is suitable for proof‑of‑concept and production designs that benefit from FPGA reprogrammability and family migration paths.

Unique Advantages

  • Substantial Logic Density:  12,060 logic elements enable implementation of complex state machines, datapaths, and custom peripherals without external ASICs.
  • Embedded Memory On‑Chip:  Approximately 0.24 Mbits of RAM reduces dependence on external memory for many buffering and temporary storage needs.
  • Flexible I/O Count:  173 user I/O pins allow integration of multiple interfaces and sensors while keeping board complexity manageable.
  • Compact, Surface‑Mount Package:  The 240‑BFQFP/240‑PQFP (32×32) package enables space‑efficient PCB designs and standard SMT assembly flows.
  • Commercial Temperature Rating:  Rated 0 °C to 85 °C for reliable operation across typical commercial electronics deployments.
  • RoHS Compliance:  Meets lead‑free manufacturing requirements for modern electronics production.

Why Choose EP1C12Q240C7?

The EP1C12Q240C7 delivers a practical balance of logic capacity, embedded memory, and I/O in a compact 240‑pin package, making it well suited for designers needing mid‑range FPGA resources without overspecifying device size. Its Cyclone family heritage brings established architectural capabilities—such as PLLs and support for a range of I/O standards—while the device’s commercial temperature rating and RoHS compliance align with mainstream electronics production requirements.

Select this part for applications where reprogrammability, moderate on‑chip memory, and a substantial count of user I/O reduce board complexity and accelerate time‑to‑market. The EP1C12Q240C7 is appropriate for system designers, hardware engineers, and product teams looking to integrate configurable logic into consumer, communications, and embedded products.

Request a quote or submit an inquiry to check current pricing and availability for the EP1C12Q240C7 and to discuss how this Cyclone FPGA can fit into your next design.

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