EP1C12Q240C8N

IC FPGA 173 I/O 240QFP
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 173 239616 12060 240-BFQFP

Quantity 402 Available (as of May 26, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O173Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12Q240C8N – Cyclone® FPGA, 240‑BFQFP, 173 I/O

The EP1C12Q240C8N is a Cyclone® field-programmable gate array (FPGA) offered by Intel. It implements the Cyclone family architecture and provides a balance of logic capacity, embedded memory, and flexible I/O for cost-sensitive data-path and interface applications.

Designed for commercial applications, this surface-mount device integrates 12,060 logic elements, approximately 0.24 Mbits of on-chip RAM, and multiple clock resources to support custom logic, memory interfaces, and peripheral bridging in compact board designs.

Key Features

  • Core Logic — 12,060 logic elements (LEs) to implement custom digital functions and datapaths.
  • Embedded Memory — Total on-chip RAM of 239,616 bits (approximately 0.24 Mbits) for buffering, FIFOs, and small on-chip storage.
  • I/O Density — 173 user I/O pins provided in the 240‑pin BFQFP package for flexible board-level interfacing.
  • I/O Standards and High-Speed Interfaces — Cyclone family support for LVTTL, LVCMOS, SSTL-2, SSTL-3 and LVDS I/O standards, with LVDS data-rate support called out in the family documentation.
  • Clocking — Up to two phase-locked loops (PLLs) per device for clock multiplication and phase shifting (as specified for the EP1C12 device in Cyclone family documentation).
  • Memory and External Interface Support — Family-level support for external memories such as DDR SDRAM and FCRAM for systems requiring external storage or high-throughput buffering.
  • Power — Core voltage supply range of 1.425 V to 1.575 V to match standard Cyclone device supply rails.
  • Package and Mounting — 240‑BFQFP (supplier package 240‑PQFP, 32×32) in a surface-mount form factor suitable for compact PCB layouts.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for general-purpose electronic applications.
  • Configuration and Tooling — Supports configuration through low-cost serial configuration devices and integration with Cyclone family tool flow as described in the device handbook.

Typical Applications

  • Data-Path Processing — Implement custom datapath logic, parallel processing blocks, and protocol handling where on-chip logic and RAM accelerate throughput.
  • Memory Interface Controllers — Build DDR SDRAM or FCRAM interface logic and buffering to connect external memories for intermediate storage and high-speed transfers.
  • Serial and Parallel Peripheral Bridging — Use the device’s I/O density and supported standards to implement bridges between different bus standards or custom peripherals.
  • Embedded Control and Signal Conditioning — Integrate control logic, timing generation and data formatting for consumer and industrial electronic subsystems within the commercial temperature range.
  • PCI and System Interfaces — Leverage family-level support for 33/66‑MHz PCI interfaces and other standard peripheral interfaces when designing host or subsystem connectivity.

Unique Advantages

  • Balanced Logic Capacity: 12,060 logic elements provide a mid-range fabric suitable for substantial custom logic without excess cost.
  • Integrated On-Chip RAM: Approximately 0.24 Mbits of embedded memory reduces external RAM requirements for many control and buffering tasks.
  • Flexible Clocking: Two PLLs allow clock multiplication and phase shifting to support diverse timing domains within a design.
  • Broad I/O Support: Support for multiple I/O standards and LVDS data rates in the Cyclone family enables interoperability with a wide range of peripherals and signaling levels.
  • Compact Surface-Mount Package: The 240‑BFQFP package offers a high pin count in a compact footprint for space-constrained PCBs.
  • Commercial Temperature and Supply Compatibility: 0 °C to 85 °C rating and a defined core voltage range simplify BOM planning for mainstream electronics projects.

Why Choose EP1C12Q240C8N?

The EP1C12Q240C8N positions itself as a practical Cyclone FPGA choice for engineers who need moderate logic capacity, on-chip RAM, and flexible I/O in a compact surface-mount package. Its combination of 12,060 logic elements, approximately 0.24 Mbits of embedded memory, and family-level features such as PLLs and multi-standard I/O support make it suitable for data-path functions, memory interfacing, and peripheral bridging in commercial electronics.

Designers benefit from the Cyclone family’s documented configuration and migration flow, including support in the Cyclone device handbook and the ability to migrate designs within the family while retaining pin and power compatibility planning guidance.

Request a quote or submit an inquiry to receive pricing and availability information for the EP1C12Q240C8N.

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