EP1C20F324C6

The EP1C20F324C6 is a Cyclone® family SRAM-based FPGA in a 324-ball FBGA package, delivering 20,060 logic elements and approximately 294,912 bits of embedded memory for data-path and system interfacing applications. The device implements a 1.5-V, 0.13-µm all-layer copper SRAM process and is positioned for commercial-grade designs requiring flexible I/O, on-chip clocking, and a compact surface-mount package.

Typical use cases include data-path processing, memory interface logic, and system glue where a balance of logic density, embedded RAM, and mixed I/O support is required.

Key Features

• Logic Capacity  Provides 20,060 logic elements to implement medium-complexity combinational and sequential logic.
• Embedded Memory  Approximately 294,912 bits of on-chip RAM for FIFOs, buffers, and small lookup tables.
• I/O Density  233 user I/O pins to support broad peripheral and bus connectivity in a single device.
• Configurable I/O Standards  Device family supports LVTTL, LVCMOS, SSTL-2, SSTL-3 and high-speed LVDS interfaces (LVDS up to 640 Mbps and low-speed LVDS options), enabling a range of signaling choices for system integration.
• Memory and System Interfaces  Architected to support external memories and high-bandwidth interfaces including DDR SDRAM and PCI standards (66/33 MHz, 64-/32-bit as supported by the Cyclone family).
• On-chip Clocking  Up to two PLLs per device provide clock multiplication and phase shifting for flexible clock management.
• Package and Mounting  324-FBGA (19 × 19) surface-mount package for compact board-level integration.
• Power  Nominal core supply voltage range: 1.425 V to 1.575 V.
• Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Data-Path Processing  Implements custom datapath logic, protocol conversion, and packet handling using the device’s logic elements and embedded RAM.
• Memory Interface Controllers  Used for DDR SDRAM and SDRAM interfaces where on-chip PLLs and supported I/O standards simplify timing and signaling.
• High-Speed I/O and Serialization  Leverages LVDS support and numerous I/O pins for high-speed links, video, or sensor data aggregation.
• PCI and System Glue  Acts as a bridge or interface logic for PCI-based subsystems and peripheral expansion leveraging supported PCI signaling modes.

Unique Advantages

• Highly integrated logic and memory: 20,060 logic elements combined with ~294,912 bits of embedded RAM reduce the need for external components and simplify board-level design.
• Flexible I/O support: Broad support for LVTTL, LVCMOS, SSTL, and LVDS lets you match signaling to diverse peripherals and memory interfaces.
• Compact FBGA package: 324-FBGA (19 × 19) enables high I/O count in a compact footprint for space-constrained PCBs.
• On-chip clock management: Up to two PLLs provide clock multiplication and phase shifting to meet complex timing requirements without extra silicon.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.
• Ecosystem support: Cyclone family devices are supported by Altera® MegaCore® functions and Quartus® II software for IP integration and device migration across family densities.

Why Choose EP1C20F324C6?

The EP1C20F324C6 delivers a practical balance of logic capacity, embedded memory, and flexible I/O in a compact 324-FBGA package, suited to commercial designs that require on-chip memory, clocking, and a variety of signaling standards. With two on-chip PLLs and support for common memory and I/O protocols, this Cyclone FPGA simplifies implementation of data-path and interface functions while keeping board-level BOM effort lower.

This device is a good fit for engineers and system designers building medium-complexity FPGA-based controllers, protocol bridges, or memory interface logic who need a commercially rated, RoHS-compliant FPGA with established software and IP support.

If you would like pricing, lead-time, or availability information for EP1C20F324C6, request a quote or contact sales to discuss your requirements and procurement options.