EP1C20F324C7

IC FPGA 233 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 233 294912 20060 324-BGA

Quantity 40 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O233Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2006Number of Logic Elements/Cells20060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of EP1C20F324C7 – Cyclone® Field Programmable Gate Array (FPGA) IC 233 294912 20060 324-BGA

The EP1C20F324C7 is an Intel Cyclone® family FPGA device delivering 20,060 logic elements and 294,912 bits of on-chip RAM. It is built on the Cyclone architecture described in the device handbook and is optimized for data-path applications and system interfacing where a balance of density, I/O capability, and cost-effective integration is required.

Designed for commercial-grade applications, this surface-mount 324-ball FBGA package supports a broad set of I/O standards and clocking resources, making it suitable for designs requiring flexible memory interfaces, high-speed I/O, and integrated clock management while operating within a 1.425 V to 1.575 V supply window and 0 °C to 85 °C temperature range.

Key Features

  • Core Logic  20,060 logic elements provide substantial combinational and sequential logic capacity for mid-density FPGA designs.
  • Embedded Memory  294,912 bits of on-chip RAM (approximately 0.295 Mbits) for data buffering, FIFOs, and memory-intensive datapath functions.
  • I/O Capacity & Standards  233 I/O pins and family-level support for LVTTL, LVCMOS, SSTL-2/SSTL-3 and high-speed LVDS enable interfacing with a wide variety of peripherals and external devices.
  • Clocking & Timing  Family architecture provides up to two PLLs and multiple global clock resources to support clock multiplication, phase shifting, and synchronized multi-clock designs.
  • Memory Interfaces  Cyclone family support includes dedicated DDR and SDR memory interface capability for DDR SDRAM, FCRAM, and SDR SDRAM connectivity.
  • Package & Mounting  324-ball FineLine BGA (324-FBGA, 19 × 19) in a surface-mount package for compact board integration and reliable thermal/power distribution.
  • Power & Operating Range  Device supply range 1.425 V to 1.575 V and commercial operating temperature 0 °C to 85 °C.
  • Compliance  RoHS-compliant construction for regulatory and manufacturing considerations.

Typical Applications

  • Data-path processing  Use the device's 20,060 logic elements and embedded RAM for packet processing, signal conditioning, or custom datapath blocks.
  • Memory controller and buffering  Implement DDR SDRAM or SDRAM interface logic and on-board buffering using the device’s RAM and dedicated memory interface capability.
  • High-speed serial and parallel I/O  Support LVDS and a variety of I/O standards for camera interfaces, display bridging, and high-speed link aggregation.
  • Peripheral and bus bridging  Create custom PCI/bridge logic or peripheral adapters using abundant I/O and clocking resources.

Unique Advantages

  • Substantial logic density: 20,060 logic elements enable complex state machines, DSP blocks, and control logic within a single device, reducing system BOM.
  • On-chip memory for efficient buffering: Nearly 295kbits of embedded RAM supports deep FIFOs and local scratch memory without external RAM overhead.
  • Flexible I/O and interface support: 233 I/O pins and family-level support for multiple standards let you connect diverse peripherals without extra interface chips.
  • Integrated clocking resources: Up to two PLLs and multiple global clocks simplify timing architectures for multi-rate systems and synchronous designs.
  • Compact BGA packaging: The 324-FBGA (19 × 19) package offers a space-efficient implementation for high-density board layouts.
  • Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EP1C20F324C7?

The EP1C20F324C7 combines a mid-to-high logic capacity with ample on-chip memory and extensive I/O, making it a practical choice for commercial applications that need balanced performance, interface flexibility, and compact packaging. Its Cyclone family architecture provides the clocking and memory interface features designers rely on for data-path and bridging applications.

This device is well suited for engineering teams implementing mid-density FPGA solutions who require predictable supply voltage and operating-temperature boundaries and who value the Cyclone architecture's integration of PLLs, global clocks, and embedded RAM for robust system design.

Request a quote or submit your design requirements to receive pricing and availability information for the EP1C20F324C7.

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