EP1C20F324I7

The EP1C20F324I7 is an Intel Cyclone® family SRAM-based FPGA offering 20,060 logic elements and approximately 0.295 Mbits of embedded RAM. It combines a high logic density, extensive I/O capability and family-level clocking and memory-interface features to address data-path and system integration tasks.

Targeted at industrial applications, this surface-mount device is supplied in a 324-BGA (324-FBGA, 19×19) package, supports a core supply range of 1.425 V to 1.575 V, and operates from −40 °C to 100 °C for deployments requiring extended temperature range and RoHS-compliant manufacturing.

Key Features

• Core Logic  20,060 logic elements (LEs) provide programmable logic density for complex control, datapath and glue-logic functions.
• Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for buffering, FIFOs and on-chip data storage.
• I/O Capacity  233 user I/O pins support broad system interfacing and board-level connectivity.
• Clocking and Timing (family)  Cyclone family devices support up to two PLLs and multiple global clock resources to implement clock multiplication and phase adjustments.
• High‑speed Interfaces (family)  The Cyclone family supports common high-speed I/O standards including LVDS and DDR memory interfaces useful for data-path and memory subsystem designs.
• Power and Voltage  Core supply voltage range of 1.425 V to 1.575 V enables predictable power integration into system power rails.
• Package  324‑BGA (supplier package: 324‑FBGA, 19×19) surface-mount package suitable for compact PCB layouts.
• Temperature and Grade  Industrial grade device with operating range from −40 °C to 100 °C for industrial and rugged environments.
• Regulatory  RoHS‑compliant for lead‑free manufacturing processes.

Typical Applications

• Data-path processing  Implement packet processing, protocol bridging or custom datapath logic using the device’s high logic density and embedded RAM.
• Memory interfaces  Use family-level DDR/SDR memory interface support to implement external memory controllers and buffering for system memory subsystems.
• High-speed I/O bridging  Leverage LVDS and other high-speed I/O standards supported by the Cyclone family for board-level connectivity and ASSP/ASIC interfacing.
• Industrial control and automation  Industrial-grade temperature range and ample I/O count enable motor control, sensor aggregation and deterministic control logic.

Unique Advantages

• High logic density: 20,060 logic elements permit integration of substantial custom logic, reducing reliance on external glue components.
• Substantial on-chip RAM: Approximately 0.295 Mbits of embedded memory supports buffering and state storage without immediate external memory needs.
• Generous I/O count: 233 I/O pins allow extensive peripheral and bus connections for system-level integration.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet harsh-environment deployment requirements.
• Compact BGA footprint: 324‑FBGA (19×19) package balances I/O density with a space-efficient board footprint.
• Standards and compliance: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose EP1C20F324I7?

The EP1C20F324I7 brings a balance of logic capacity, embedded memory and I/O density in an industrial‑rated Cyclone FPGA package. It is well suited for designers who need a programmable platform that can implement complex datapath logic, memory interfaces and high-speed I/O while meeting temperature and manufacturing compliance requirements.

As part of the Cyclone family, the device benefits from documented family features and tool support that simplify device migration and pin planning across density variants, helping teams scale designs and manage long‑term product evolution.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the EP1C20F324I7.