EP1C20F400C7

The EP1C20F400C7 is a Cyclone®-series SRAM-based FPGA offering 20,060 logic elements and approximately 0.295 Mbits of embedded memory in a compact 400-pin FineLine BGA package. Designed for cost-sensitive data-path and system-interfacing applications, this commercial-grade device delivers a balance of logic density, on-chip RAM, and flexible I/O connectivity.

Built on the Cyclone device architecture, the EP1C20F400C7 supports common memory and I/O interface requirements while operating from a nominal 1.5 V supply range and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 20,060 logic elements provide substantial on-chip programmable logic for complex combinational and sequential designs.
• Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM for FIFOs, buffers, and local data storage.
• I/O Density — 301 user I/O pins to support extensive peripheral and system interfacing needs.
• Clocking — Family documentation describes support for up to two PLLs per device, enabling clock multiplication and phase shifting where required.
• Package — 400-BGA (supplier designation: 400-FBGA, 21×21) surface-mount package for space-efficient board designs.
• Power — Supply voltage range 1.425 V to 1.575 V suitable for the Cyclone 1.5 V process node referenced in the device family documentation.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Standards & Interfaces (family-level) — Cyclone family documentation indicates support for common I/O standards and interfaces, including LVDS and PCI signaling conventions.
• RoHS Compliant — Device is RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Data-path processing — Use the device’s logic capacity and on-chip RAM for packet processing, signal handling, and other throughput-focused tasks.
• Memory interface bridging — Suitable for designs requiring DDR SDRAM or other external memory interfaces supported by the Cyclone family.
• High-density I/O systems — 301 I/O pins enable integration with multiple peripherals, buses, and external devices in embedded systems.
• Custom logic and prototyping — Provides a configurable platform for implementing application-specific logic and validating system-level designs.

Unique Advantages

• Substantial logic density: 20,060 logic elements enable implementation of large combinational and sequential logic networks without immediately resorting to external logic.
• Significant on-chip memory: Nearly 0.295 Mbits of embedded RAM reduces reliance on off-chip buffering for many control and data-path tasks.
• High I/O count: 301 user I/O pins provide flexibility to connect multiple peripherals, buses, and custom interfaces.
• Compact BGA footprint: 400-FBGA (21×21) surface-mount package helps minimize PCB area while maintaining thermal and signal integrity for dense designs.
• Design migration support (family-level): Cyclone family documentation describes vertical migration practices across densities and packages, aiding planned device upgrades or down-scaling.
• Toolchain compatibility (family-level): Documentation references support in the Quartus® II software for pin cross-referencing and device migration workflows.

Why Choose EP1C20F400C7?

The EP1C20F400C7 positions itself as a capable Cyclone-series FPGA for customers seeking a balance of logic capacity, embedded memory, and extensive I/O in a 400-BGA footprint. Its 20,060 logic elements and nearly 295 kbits of RAM make it appropriate for medium-to-large programmable logic tasks where board space and I/O density are priorities.

Designed for commercial applications, this device is suited to designers who need predictable operating conditions (1.425 V–1.575 V supply, 0 °C–85 °C) and RoHS compliance, with family-level features such as PLL-based clocking and toolchain support to streamline development and migration across device densities.

Request a quote or submit an inquiry to receive pricing and availability for the EP1C20F400C7 and to discuss how it fits your next FPGA-based design.