EP1C20F400I7

The EP1C20F400I7 is a Cyclone® family SRAM-based FPGA in a 400-FBGA (21×21) package designed for industrial applications. It integrates 20,060 logic elements, approximately 0.295 Mbits of embedded memory, and 301 user I/O pins to address data-path, memory-interface, and system-integration requirements.

Built on the Cyclone architecture, the device supports on-chip clocking resources and common high-speed I/O standards, making it suitable for designs that need flexible interfacing, deterministic clocking, and compact surface-mount implementation.

Key Features

• Logic Capacity — 20,060 logic elements provide a high density of programmable logic for complex combinational and sequential functions.
• Embedded Memory — Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for data buffering, FIFOs, and small working memory blocks.
• I/O Count and Standards — 301 user I/O pins with family-level support for LVTTL, LVCMOS, SSTL-2, SSTL-3, LVDS, and other common I/O standards for board-level interfacing.
• Clocking and PLLs — Up to two on-chip PLLs (family specification) to enable clock multiplication and phase shifting for system timing flexibility.
• Memory Interfaces — Cyclone family support for external memory interfaces including DDR SDRAM and FCRAM for applications requiring off-chip storage.
• Package and Mounting — 400-FBGA (21×21) package in a surface-mount form factor for compact board integration.
• Power Supply — Core supply range of 1.425 V to 1.575 V to match system power rails.
• Operating Temperature — Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• Data-Path Processing — Implement combinational and sequential logic for packet processing, protocol handling, and signal conditioning using the 20,060 logic elements and on-chip RAM.
• Memory Interface Controllers — Bridge to external memories (DDR SDRAM, FCRAM, SDRAM) leveraging the Cyclone family memory-interface support and available I/O standards.
• High-Speed I/O Bridging — Connect high-speed serial or parallel devices using LVDS-capable I/Os and flexible I/O standard support for board-level interfacing.
• Embedded System Integration — Consolidate glue logic, peripheral interfaces, and clock management in a single FPGA to reduce system BOM and board area in industrial applications.

Unique Advantages

• High Logic Density: 20,060 logic elements allow consolidation of multiple functions into a single device, reducing board complexity.
• Substantial On-Chip RAM: Approximately 0.295 Mbits of embedded memory supports buffering and local data storage without immediate off-chip dependency.
• Flexible Clocking: Up to two PLLs provide clock multiplication and phase-shifting capabilities for precise timing control.
• Extensive I/O Capability: 301 user I/Os and family support for a wide set of standards give design flexibility for diverse interfaces.
• Industrial Temperature Range: Operates from −40 °C to 100 °C to meet temperature demands in industrial environments.
• Compact BGA Package: 400-FBGA (21×21) surface-mount package enables space-efficient board designs.

Why Choose EP1C20F400I7?

The EP1C20F400I7 positions itself as a flexible, industrial-grade Cyclone FPGA that combines high programmable logic density, nearly 0.295 Mbits of embedded RAM, and a broad set of I/O resources in a compact 400-FBGA package. Its family-level features—dual PLLs, support for common I/O standards, and external memory interfacing—make it well suited for engineers designing data-path, memory-controller, and system-integration solutions that require deterministic clocking and a high pin count.

This device is appropriate for development teams and OEMs targeting industrial applications who need a balance of integration, performance, and footprint, while maintaining compliance with RoHS environmental requirements.

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