EP1C20F400I7N

The EP1C20F400I7N is a Cyclone® FPGA device offering 20,060 logic elements and approximately 294,912 bits of embedded RAM in a 400-ball FineLine BGA (21×21) package. Based on the Cyclone family architecture, this device targets data-path and interface-heavy designs that require a balance of logic density, on-chip memory, and high-speed I/O support.

Designed for industrial-grade applications, the device operates over a −40 °C to 100 °C temperature range and uses a 1.425 V to 1.575 V core supply. It integrates features common to the Cyclone family such as on-chip PLLs, high-speed I/O standards support, and interfaces for external memory, enabling flexible system integration.

Key Features

• Logic Capacity — 20,060 logic elements provide programmable fabric for complex datapath, control, and glue-logic implementations.
• On-Chip Memory — Approximately 294,912 bits of embedded RAM (36,864 bytes) for FIFOs, buffers, and local data storage.
• I/O Resources — Up to 301 user I/O pins to support a wide range of peripherals and external interfaces.
• Clocking — Up to two PLLs and multiple global clock lines to support clock multiplication and phase alignment for synchronous designs.
• High-Speed Interface Support — Cyclone family features include support for LVDS (up to 640 Mbps), RSDS, and industry-standard PCI (66/33 MHz, 64/32-bit) interfaces, enabling high-rate serial and parallel connections.
• Memory Interface — Architecture supports DDR SDRAM and other external memory interfaces for systems requiring expanded dynamic memory.
• Package and Mounting — 400-FBGA (21×21) surface-mount package suitable for compact PCB integration.
• Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for industrial environments.
• Core Voltage — Operates from 1.425 V to 1.575 V, matching the Cyclone family’s 1.5‑V process requirements.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Data-path processing — Use the device’s logic density and embedded RAM to implement packet processing, stream buffering, and custom datapath accelerators.
• Memory interface bridging — Integrate DDR SDRAM interfaces and on-chip PLLs to manage external memory timing and data buffering.
• High-speed I/O systems — Leverage LVDS and PCI support for high-rate serial links and legacy parallel peripherals.
• Embedded control and glue logic — Replace multiple discrete components with a single programmable device for control, state machines, and protocol conversion.

Unique Advantages

• Balanced logic and memory — 20,060 logic elements combined with ~294,912 bits of RAM enables mid-range designs that require both computational fabric and local storage without external SRAM for many functions.
• Flexible I/O count — 301 I/O pins support complex mixed-signal systems and multi-interface boards, reducing the need for external multiplexers.
• Industrial robustness — Specified for −40 °C to 100 °C operation to meet the environmental demands of industrial applications.
• Compact, manufacturable package — 400-FBGA (21×21) offers a high-pin-count solution in a compact, surface-mount form factor suitable for production assemblies.
• Clocking and timing flexibility — On-chip PLLs and multiple global clock resources simplify clock-domain management for complex synchronous designs.
• Standards support — Cyclone family features include support for LVDS, PCI, and DDR interfaces to ease integration with common high-speed peripherals and memory.

Why Choose EP1C20F400I7N?

EP1C20F400I7N positions itself as a practical, industrial-grade Cyclone FPGA choice for designers who need substantial logic capacity, meaningful on-chip RAM, and broad I/O flexibility in a compact BGA package. Its combination of programmable resources and support for high-speed interfaces makes it well suited to mid-range data-path, memory-interface, and system-integration tasks.

For teams building systems that require scalable FPGA resources with industrial temperature range and RoHS compliance, EP1C20F400I7N offers a reliable platform that aligns with Cyclone family capabilities and design flows.

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