EP1C3T100C6

The EP1C3T100C6 is a Cyclone® family FPGA manufactured by Intel, delivered in a 100‑pin TQFP (14×14) surface-mount package. It implements 2,910 logic elements and approximately 59.9 Kbits of embedded RAM, providing a compact, low-voltage programmable fabric for data‑path and interface tasks.

Designed for commercial applications, this device targets use cases such as data-path processing, protocol bridging, and embedded logic acceleration where a balance of integration, low-voltage operation, and package simplicity is required.

Key Features

• Logic Capacity  2,910 logic elements suitable for small to medium programmable logic tasks and glue‑logic integration.
• Embedded Memory  Approximately 59.9 Kbits of on‑chip RAM for FIFOs, small buffers, and state storage.
• I/O  65 user I/O pins provided in the 100‑TQFP (14×14) package for signal interfacing and peripheral connectivity.
• Clocking  Cyclone family clocking features are supported; the EP1C3 device includes one PLL for clock multiplication and phase management.
• Power and Operating Range  Core supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C for typical commercial environments.
• Package and Mounting  100‑pin TQFP (14×14) surface‑mount package simplifies board layout for compact designs.
• Compliance  RoHS compliant, enabling lead‑free assembly processes and regulatory alignment for commercial products.

Typical Applications

• Data‑Path Processing  Implement small to medium data‑path logic, parallel processing blocks, and control logic leveraging 2,910 logic elements and on‑chip RAM.
• Memory Interface and Buffering  Use the embedded RAM for buffering and temporary data storage in systems requiring local FIFO or small cache structures.
• Protocol Bridging and Interface Glue  Deploy as protocol translators or interface glue between ASSP/ASIC components and peripherals where flexible I/O mapping is needed.
• Embedded Logic and Prototyping  Evaluate and prototype custom logic functions in a commercially graded FPGA platform with a compact TQFP footprint.

Unique Advantages

• Compact Logic and Memory Integration: 2,910 logic elements paired with ~59.9 Kbits of RAM reduce external component count for control and buffering tasks.
• Low‑Voltage Core Operation: The 1.425 V–1.575 V core supply enables designs aligned with Cyclone family low‑voltage operation while supporting a standard commercial power domain.
• Single‑PLL Clocking: On‑device PLL simplifies clocking for designs that need basic clock multiplication or phase adjustment without adding external clock management ICs.
• Surface‑Mount TQFP Packaging: The 100‑TQFP (14×14) package balances board‑level ease of assembly and compact footprint for space‑constrained applications.
• RoHS Compliant: Supports lead‑free assembly workflows and regulatory compliance for commercial product lines.
• Commercial Temperature Grade: Rated 0 °C to 85 °C for typical commercial deployments and consumer or enterprise electronics.

Why Choose EP1C3T100C6?

The EP1C3T100C6 offers a focused combination of programmable logic, embedded RAM, and single‑PLL clocking in a compact 100‑pin TQFP package, making it well suited for designers who need a low‑voltage, commercially graded FPGA for data‑path, interface, and embedded logic applications. Its on‑chip resources simplify board design by minimizing external buffering and glue logic.

This Cyclone family device provides predictable scalability and support from the Cyclone architecture, delivering long‑term design continuity for commercial FPGA projects that prioritize integration, compact packaging, and RoHS compliance.

Request a quote or submit a price inquiry today to evaluate EP1C3T100C6 for your next design.